American Components, Inc.

Charles L Wellard

The present method and device provides that a thickness of wet ceramic material is laid down and partially dried to provide a base. This step is followed by screen printing one or more patterns of electrical resistance material on the upper surface of the partially dried ceramic base. Thereafter a second thickness of said wet ceramic is laid down and partially dried. In the event that the fabricator desires to provide a plurality of resistance paths, or a capacitor, in a single package, the foregoing process can be repeated with additional patterns of resistance material laid down or conductor material for a capacitor laid down, on the upper layer of partially dried ceramic material. The resistance or conductor patterns are sandwiched by additional thicknesses of ceramic materials screen stacked thereon. When the desired package has been achieved, the multi layered arrangement is given a final drying and it is then diced and fired. Thereafter termination means are provided to the fired diced sections, thus making up chip components.

Method for making a chip circuit component

In the present device, a base member is included which has channels formed therein to hold lead wires. In the preferred embodiment a metal foil resistor member, having termination land sections, is secured to the base member to form a fourth side for each channel, thereby securely locating the lead wires in the channels and the lead wires are firmly connected to the termination land sections of the foil resistor. Accordingly with respect to the foil resistor assembly: there is good physical strength to withstand external forces; the resistor reliability is enhanced; the fabrication is simplified; and the resistance range capability is increased.

Foil type resistor with firmly fixed lead wires

The present hermetically-sealed electrical resistor component assembly is composed of a sleeve of high-density, non-porous, non-hydroscopic material into which there is slip-fitted an electrical resistor component. Said electrical resistor component is sealed within said sleeve by a deposit of solder at each end of said sleeve whereat said solder clings to said sleeve, to the end cap of said resistor, and to the lead wire extending from said end cap. In some embodiments silicon rubber is employed as a gasket disposed along the end of said cap whereat it abuts said sleeve. In another embodiment, the entire package is encapsulated in a plastic material such as silicone-epoxy.

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Oaks, PA, United States of America

Charles L Wellard