Asm Technology Singapore Pte Ltd

Charles Joseph Vath, Iii

Teng Hock Kuah

Shu Chuen Ho

Loon Aik Lim

Si Liang Lu

Man Ho Hui

Juay Sim Koh

Srikanth Narasimulau

A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

Capillary for wire bonding

A mold ( ) is for molding a one-sided encapsulated electronic device. The mold ( ) includes a first mold section ( ) defining a mold cavity ( ), and a second mold section ( ) including a first recessed portion ( ) adapted to receive a layer of material ( ) attached to a leadframe ( ), but not the leadframe ( ).

Mold and method for encapsulation of electronic device

A mold ( ) for a semiconductor chip ( ) has two mold halves ( ). One mold half ( ) includes sealing means ( ) adapted to exert a sealing pressure between a surface of the mold and a surface ( ) of a substrate ( ) located in the mold ( ) during a molding operation.

Mold for a semiconductor chip

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Singapore, Singapore

Charles Joseph Vath, Iii