Lucent Technologies Inc.

Avaya Technology LLC

Charles Joseph Buondelmonte

Louis Thomas Manzione

Hui Wu

Ron Jay Barnett

Richard Franklin Schwartz

Ilya Alexander Korisch

Nagesh R Basavanhally

Walter J Picot

Girard Sidone

Thaddeus Wojcik

A new physical design for electronic devices ( ) comprises a multi-layer stacked assembly ( ) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array ( ) or a filter array ( ) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges ( ) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g., a layer ( ) that forms a part of the chamber that houses the filter array also acts as a reflector plane for the antenna array.

Electronic stacked assembly

A resonant capacitive coupler (,) couples signals across a gap (,) between signal transmission lines (,) of two printed wiring boards (,). The coupler has a conductive contact member (,or,) that is either positioned in close proximity to one of the transmission lines (,) or is connected to the one transmission line via a dielectric (,or,), and forms a capacitor therewith. The coupler further has a conductive interconnect member (,or,) that is connected to the contact member, and also to the other transmission line (,) either directly (FIG.,) or via a second conductive contact member (,) (FIG.,). The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members. The coupler therefore resonates at the signal frequency, and relative to conventional capacitive coupling achieves a low-loss interconnection over large gaps while requiring only small capacitance to do so.

Resonant capacitive coupler

A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.

Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage

A fixture assembly for securing a component to a heat sink includes a frame having two parallel longitudinal members connected by first and second transverse crossbeams, which together define a receptacle into which a component is received. A spring clip is rotatably attached to the frame and has a position in which the spring clip presses the component against a heat sink. The frame includes at least two depending legs for supporting the frame above the surface of a heat sink, and at least one opening for receiving a fastener that secures the frame to the heat sink. A guide peg or similar positioning structure may also be provided for positioning the frame on the heat sink. The spring clip includes a proximal end having a non-round cross section which is rotatably attached to the first transverse crossbeam of the frame, and a distal end which includes a resilient lip which is detachably engage able with the second transverse crossbeam. In another embodiment of the invention, the fixture includes a frame having a pair of receptacles each having a spring clip associated therewith, for simultaneously securing two electronic components to a heat sink.

Fixture for securing a component to a heat sink

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Yardley, PA, United States of America

Charles Joseph Buondelmonte