Lockheed Martin Corporation

General Electric Company

Sandia Corporation

Charles John Kryzak

Brian Scott Leininger

William P Kornrumpf

Rick C Stevens

Kevin J Thorson

Brian Ralph Larson

Robert J Monson

Joseph Alfred Iannotti

Samhita Dasgupta

Glenn A Forman

Darwin K Serkland

Jianhua Yan

Richard L Cellini

Gordon Arthur Keeler

Kent M Geib

Olga B Spahn

William D Cowan

Daryl J Dagel

Thomas Derco

The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.

Micro electro mechanical system optical switching

One apparatus embodiment includes an optical emitter and a photodetector. At least a portion of the optical emitter extends a radial distance from a center point. The photodetector provided around at least a portion of the optical emitter and positioned outside the radial distance of the portion of the optical emitter.

Fault location in optical networks

A parallel mounted MEMs optical diagnostic switch disposed within an optical connector for directing optical signals from one or a plurality of light sources to one or a plurality of light collectors by activating a feedback loop through the use of micro electro mechanical systems (MEMS). The present invention includes one or more mirrors mounted parallel to the path of optical transmission through the tool. The mirrors and can be automatically activated at power up or selectively thereafter for detecting faults in any upstream fiber optic component. When in the passive mode, the present invention retracts away from the optical path so as not to interfere with normal system operations.

Mounted MEMs optical diagnostic switch

An optical lens structure includes a substantially transparent substrate a lens array attached to the substrate with lenses of the lens array situated opposite the substrate and packaging material surrounding at least the periphery of the lens array, the packaging material including at least two alignment holes which are aligned with respect to positions of the lenses. In one example, the structure is fabricated by attaching a lens array to a substrate with lenses of the lens array situated opposite the substrate, surrounding a periphery of the lens array with a packaging material, the packaging material being attached to the substrate, planarizing the packaging material, and providing alignment holes through the packaging material.

Lens array package and fabrication method

A method of positioning an optoelectronic device, for example a vertical cavity surface emitting laser, onto an optical fiber connector and maintaining that exact alignment while testing the quality of the optical output prior to applying an adhesive to make the interface permanent. The method includes the utilization of a multi-piece fixture which clamps the elements into position, allows for testing, and provides a fixture to maintain position throughout the curing process.

Method and apparatus for assembly of an optoelectronic device with an optical connector

An active optical device having a plurality of optical receiving or transmitting elements is secured to a carrier having two holes adapted to receive respective alignment pins of the connector. The optical device is secured to the carrier by a first solder ball contract array pattern on a surface of the optical device substrate and a second matching solder ball contact array pattern on a surface of the carrier. Solder balls disposed between the first solder ball contact array pattern of the optical device substrate and the second solder ball contact array pattern are melted so that solder reflow self-aligns the patterns, and further positions the optical device array in a predetermined orientation with respect to the alignment holes in the carrier. A flexible electrical interconnect member having a plurality of electrical traces is coupled to the active optical device at one of its ends and the other end is available for coupling to another device.

Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications

Scalable Computer Interconnect (CSI) compliant multi-stage switching networks compactly electrically communicatively interconnect a large number N of electrically communicating devices, typically computers or memories, in three-dimensional space. The logic networks, including a preferred &ldquo;layered network&rdquo; of U.S. Pat. No. 4,833,468, are (i) rotated, (ii) folded and (iii) squared per companion U.S. Pat. No. 6,301,247 so as to assume optimal topology. The topologically-optimized switching network logic is physically realized as (i) planar panels each mounting multi-chip modules, or tiles, each having logic switchpoints each realized by switch dice, plus vias through the tiles, plus pads upon both sides of the tiles, plus connective wiring layers upon the tile, connected by (ii) multi-conductor flexible flat printed circuit cables located between the adjacent panels. System peak performance is 24 teraflops/second.

Three-dimensional interconnection geometries for multi-stage switching networks using flexible ribbon cable connection between multiple planes

A method of terminating multiple optical fibers, by placing terminal ends of the fibers into a connector to create a fiber end face array, locating a plurality of optical devices on a substrate in an array having a matching geometry as the fiber end face array, and positioning the connector with respect to the substrate to align the fiber end face array with the optical device array. The optical device substrate can be formed as part of a fiber termination fixture which further includes a carrier having two holes adapted to receive respective alignment pins of the connector. The optical device substrate is advantageously affixed to the carrier by forming a first solder ball contact array pattern on a surface of the optical device substrate, forming a second solder ball contact array pattern on a surface of the carrier, wherein the second solder ball contact array pattern matches the first solder ball contact array pattern, and melting a plurality of solder balls disposed between the first solder ball contact array pattern of the optical device substrate and the second solder ball contact array pattern of the carrier such that solder reflow self-aligns the patterns, and further positions the optical device array in a predetermined orientation with respect to the alignment holes in the carrier.

An adhesive layer is applied to the surface of a flat, transparent flexible circuit that contains electrically conductive traces one, or more, electronic components is secured by the adhesive layer to the flexible circuit. A dam is formed that encircles at least a substantial portion of the component. A potting material fills the dam such that it encapsulates at least a substantial portion of the component. At least one via is provided in the flexible circuit and the adhesive layer in which electrically conductive material forms an electrical connection to the component. Additional vias are formed in the flexible circuit and the adhesive layer as required to make electrical connections to the traces of the flexible circuit. The component may be secured to a heat sink and the potting fill material may be removed to that it does not entirely cover the surface of the heat sink so that the surface of the heat sink that is remote from the component allows heat to escape into the surrounding environment. Additional flexible circuits may be secured to the first flexible circuit layer, and additional vias with electrically conductive material may be used to connect to the electrically conductive traces of the same, or different layers. The assembly is particularly advantageous for optical components wherein the flexible circuit is positioned adjacent the optical component and allows optical signals to be transmitted through the flexible circuit.

Optical array chip packages with passive alignment features

Dense physical and electrical connection of (i) flat flexible multiconductor cables of the printed circuit or ribbon types, to (ii) to spaced-parallel planar modules, particularly to switching modules containing switching chips, is realized by (1) a particular connection geometry in combination with (2) a spring clip connector. Flat flexible multiconductor cables routed through free space either in (i) &ldquo;X&rdquo; and, optionally also, &ldquo;Z&rdquo; planes, or else in (ii) &ldquo;Y&rdquo; planes exclusively, have their conductors' ends stripped and bent 90&deg; so as to lie upon conductive pads, arrayed along lines angled 45&deg; to both the &ldquo;X&rdquo; and &ldquo;Y&rdquo; planes, located on the substrates of switching modules that are within &ldquo;Z&rdquo; planes. A substantially square, substantially planar, spring clip mounts and re-mounts to the substrate by, preferably, two tabs fitting in a corresponding two holes in the substrate, so as to hold exposed conductor ends of each cable bent 90&deg; compressively against a portion of the arrayed conductive pads, making electrical connections.

Pad and cable geometries for spring clip mounting and electrically connecting flat flexible multiconductor printed circuit cables to switching chips on spaced-parallel planar modules

Growing community of inventors

Mendota Heights, MN, United States of America

Charles John Kryzak