Baidu USA LLC

Sun Microsystems, Inc.

Cisco Technology, Inc.

Charles J Ingalz

Tianyi Gao

Ali Heydari

Yan Cui

Ronald D Lutz, Jr

Perry L Hayden, Sr

Weiyu Wendy Lu

Bill Hin Yi Fong

Eric Mahendra Kumar

Manasa Sahini

Howard Lee Davidson

Dennis M Pfister

Charles M Byrd

Shuai Shao

Ken W Chaney

An electronic rack includes a heat removal liquid manifold, a number of server slots, and a number of server blades inserted therein. The liquid manifold distributes heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain information technology (IT) components and a quick-release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute the heat removal liquid to the IT components. The first liquid intake connector and the first liquid outlet connector are capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold, respectively. The quick-release coupling assembly can self-retract and be secure to a block holder when disconnected.

Modular quick-release liquid heat removal coupling system for electronic racks

An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

Modular self-aligning liquid heat removal coupling system for electronic racks

An optimal controller is utilized minimize a total energy consumption of a CDU and cooling fans by optimizing a liquid pump speed of the CDU and fan speeds of the cooling fans collectively, while satisfying a set of constraints associated with liquid pump and the cooling fans. The total energy consumption includes a liquid pump energy cost and a fan energy cost. The optimal controller is to control the pump speed and fan speed at the same time to minimize the total energy cost, while keeping the processor's temperature below a predetermined reference temperature using an optimization function or model. The optimization model includes both the liquid and air cooling dynamics and converted the dynamics to a convex optimization problem. The optimization is performed to determine a set of pump speed and fan speeds such that the objective function reaches minimum, while the constraints are satisfied.

Optimal controller for hybrid liquid-air cooling system of electronic racks of a data center

A liquid control architecture is designed to control a liquid flow rate based on the workload of the IT components of an electronic rack, which provides sufficient cooling capability to each IT component, saving a total cost of pump energy. A coolant distribution unit (CDU) is included in each electronic rack to pump a liquid flow to a liquid supply manifold of the electronic rack. Each outlet on the supply manifold provides heat removal liquid to each IT component (e.g., one or more GPUs of a server blade) using flexible tubing. The liquid heat removal system utilizes the workload of each IT component to drive the CDU pump speed. In addition, the temperature of the IT components rather than return liquid temperature is utilized as a baseline to monitor the temperature of the electronic rack and change the control logic (e.g., liquid flow rate) as needed.

Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks

An electronic rack includes a plurality of information technology (IT) components arranged in a stack, and a rack power supply having a voltage converter and a voltage regulator. The rack power supply to receive an input voltage from a power source, where the voltage converter is to convert the input voltage into an intermediate voltage, where the voltage regulator is to regulate the intermediate voltage to generate a regulated voltage to be supplied to the plurality of the IT components. Each electronic rack includes a fan system having one or more fan units coupled to the rack power supply to provide cooling air to reduce an operating temperature of the IT components, where each of the fan units is to receive the intermediate voltage without going through the voltage regulator and to provide power to a fan of the fan unit.

Method of improving efficiency of fan in information technology hardware

An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.

Liquid-assisted bottom air cooling of electronic racks in data centers

A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.

An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.

Viewing angle system for backlighted displays

A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.

Interleaved memory heat sink

An electro-desorption actuator comprises a fixed member, a movable member which is coupled to the fixed member, a pressure chamber which is disposed between the fixed member and the movable member, and a sorption compression system which is in communication with the pressure chamber. The sorption compression system comprises first and second electrical conductors, a sorbent which is positioned between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, and a power supply which is connected to the conductors and which is selectively actuated to generate a current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction. The sorbate is communicated from the sorption compression system to the pressure chamber during the desorption reaction and from the pressure chamber back to the sorption compression system during the adsorption reaction. Thus, during the desorption reaction a relatively high pressure is created in the pressure chamber which will displace the movable member in one direction, and during the adsorption reaction a relatively low pressure is created in the pressure chamber which will displace the movable member in the opposite direction.

Electro-desorption actuator

An apparatus for mounting an integrated circuit chip to a main printed circuit board is disclosed. The mounting apparatus is particularly suitable for situations in which a cooling device of significant mass is used to cool the integrated circuit chip. In one embodiment, the mounting apparatus mounts the integrated circuit chip onto a daughter or sub-printed circuit (PC) board, attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip and the daughter or sub-PC board) with support members, and uses flexible conductors to electrically connect the daughter or sub-PC board to the main printed circuit board. In another embodiment, the mounting apparatus attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip) with support members, and uses a flexible connection means to electrically connect the integrated circuit chip to the printed circuit board. In either case, inertial loads, particularly those associated with the mass of the cooling device, induced by impulse forces or vibrations are shielded from damaging the connections between the integrated circuit chip and the associated printed circuit board. A method for mounting an integrated circuit is also disclosed.

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San Jose, CA, United States of America

Charles J Ingalz