Commscope Technologies LLC

John Mezzalingua Associates, Inc.

Andrew Corporation

Charles J Buondelmonte

Niranjan Sundararajan

Wengang Chen

Julian Rockwell Colapietro

Jonathon C Veihl

Andrew Adams Litteer

Lance Darren Bamford

Evan Christopher Wayton

Taehee Jang

Rajiv Chandrasekaran

John Stanley Rucki

Gregory Joseph Maley

Jay Zhu

Morgan C Kurk

Richard Franklin Schwartz

Sanjay Sudhaker Upasani

Steven Schmutzler

Michael F Bonczyk

Calvin Dickerson

Alex Waldauer

Ray K Butler

Joseph P Mendelsohn

Edward Bradley

Richard William Brown

Jimmie L Donaldson, Jr

Min Li

Ed Bradley

Steven Lee Schmutzler

An antenna that enables dense packing of radiators includes a plurality of first radiators configured to radiate in a first frequency band and a plurality of second radiators configured to radiate in a second frequency band, the second frequency band having higher frequencies than the first frequency band. each of the plurality of first radiators includes a plurality of dipole arms. Each of the plurality of dipole arms includes a periodic pattern of inductive choke segments, and each of the dipole arms has a broken peripheral current path.

Antenna radiator with pre-configured cloaking to enable dense placement of radiators of multiple bands

Disclosed is a high performance low cost multiband antenna configuration that has a low band dipole having dipole arms formed of stamped sheet metal with a plurality of inductor structures. The plurality of inductor structures are oriented along a longitudinal axis of the low band dipole arm, and others are oriented orthogonal to the longitudinal axis. The plurality of the inductor structures act as cloaking structures that make the low band dipole substantially transparent to high band RF energy without inhibiting the performance of the dipole in the low band.

Low cost high performance multiband cellular antenna with cloaked monolithic metal dipole

Disclosed is an antenna that enables dense packing of low band, mid band, and C-band radiators. The low band radiators have a plurality of dipole arms that minimize re-radiation of either RF energy emitted by either the mid band or C-Band radiators. In one embodiment, the dipole arms are formed of a two-dimensional structure that has a shape that substantially prevents re-radiation in both the mid band and the C-band. In another embodiment, the dipole arms have two different configurations: a first configuration optimized for preventing re-radiation in the mid band, and a second configuration optimized for preventing re-radiation in the C-Band. In the latter embodiment, the low band radiators in close proximity to the mid band radiators have dipole arms of the first configuration, and the low band radiators in close proximity to the C-Band radiators have dipole arms of the second configuration.

Disclosed is a telecommunications antenna having a plurality of cloaked low band (LB) and high band (HB) dipoles. The LB and HB dipoles provide cloaking by breaking the dipoles into dipole segments, and providing conductive cloaking elements over the gaps between dipole segments to form a plurality of capacitors along the dipole. The capacitors along the LB dipoles provide a low impedance to LB RF signals and a high impedance to HB signals. The capacitors formed on the HB dipoles provide a low impedance to RF signals and high impedance to harmonics of the LB RF signals. This cross-cloaking of dipoles enables more dense arrangements of LB and HB dipoles on an antenna array face, providing opportunities to arrange, for example, the LB dipoles with an array factor that results in an advantageous fast roll off gain pattern.

Multi-band fast roll off antenna having multilayer PCB-formed cloaked dipoles

Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.

Wrap around antenna

Disclosed is a high performance low cost multiband antenna configuration that has a low band dipole having dipole arms formed of stamped sheet metal that has a plurality of slots. Some of the slots are oriented along a longitudinal axis of the low band dipole arm, and others are oriented orthogonal to the longitudinal axis. The presence of the slots creates a plurality of inductor structures, which act has cloaking structures that make the low band dipole substantially transparent to high band RF energy without inhibiting the performance of the dipole in the low band.

Multi-band fast roll off antenna having multi-layer PCB-formed cloaked dipoles

Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.

Multi-band base station antennas having multi-layer feed boards

In one embodiment, an antenna assembly in a cellular network has a radome that houses a plurality of antenna arrays and an electronics module. The electronics module has a weatherproof housing that encloses electronics for processing signals received by and transmitted from a first of the antenna arrays. The electronics module is physically removeably connected to an outer surface of the radome and electrically removeably connected to the first antenna array, such that the electronics module can be removed without (i) disrupting service to other antenna arrays and (ii) removing the antenna assembly from the cell tower on which the antenna assembly is installed.

Antenna radome with removeably connected electronics module

A modular wireless communications station includes a standard antenna interface, a wireless communications antenna, and a remote radio head. The standard interface includes an antenna mount for the wireless communications antenna and at least one radio head mount. The radio head mount includes at least one linear guided support structure. The wireless communications antenna includes a bracket configured to engage the antenna mount and at least one RF interconnection module, the wireless communications antenna being mounted on the antenna mount. The remote radio head(s) include a low friction car configured to engage the linear guided support structure of the standard interface and an RF connector configured to engage the RF interconnection module of the antenna. The remote radio head may slide into engagement with the antenna and locked into place.

Standard antenna interface

A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board

Growing community of inventors

Glen Gardner, NJ, United States of America

Charles J Buondelmonte