Lunar Energy, Inc.

Charles Ingalz

Peter H J How

Stephen Robert Bannick

Mark Daniel Goldman

Bozhi Yang

Steven Nicholas Grolle

Andrew Diao

Christopher McCarthy

Gargi Kailkhura

Kevin Richard Fine

Christopher Breckenridge Todd

Aaron Nealy

Xu She

Wendy Trattner

In various embodiments, an inductor thermal management system includes an inductor, and a heat sink. The heat sink includes a cavity and a spacer adapted to situate the inductor within the cavity and separate the inductor from at least one wall of the cavity such that heat is transferred from the inductor into the heat sink multi-directionally.

Inductor thermal management system

Embodiments of a transistor package construction is disclosed, including: a transistor comprising: a source; and a drain; and a package comprising: a metallic back surface that is electrically connected to the drain; a top surface comprising a notch; and a thermally conductive and electrically insulating layer covering at least a portion of the metallic back surface of the package.

Transistor package comprising thermally conductive and electrically insulating layer

A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.

Cover for sealing a power module

A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.

Thermal management system including an overmolded layer and a conductive layer over a circuit board

1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides;

Antenna pass through module

An insulating enclosure is disclosed, including: an opening in a side of the insulating enclosure, wherein the opening provides a conductor within a conduit passage into an interior of the insulating enclosure, wherein the conductor is to carry current from the inverter module, wherein a conductive sheath of the conduit is mechanically connected to the insulating enclosure via the opening; and a conductive liner, wherein the conductive liner provides a ground plane for components within the insulating enclosure, wherein the conductive liner covers at least a portion of the side of the insulating enclosure, and wherein the conductive liner is electrically connected to the conductive sheath of the conduit.

Insulating enclosure with a conductive liner

A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.

Thermal interface sandwich

A gantry for thermal management is disclosed, including: a heat generating component that includes a top surface and a bottom surface; a heat sink; a thermally conductive and electrically insulating material that is in direct contact with the heat sink; and a gantry extending above the heat generating component, wherein the gantry pushes a pin against the top surface of the heat generating component such that the bottom surface of the heat generating component is pushed against the thermally conductive and electrically insulating material.

Growing community of inventors

San Jose, CA, United States of America

Charles Ingalz