International Business Machines Corporation

Other

Charles Hampton Perry

John Ulrich Knickerbocker

James N Humenik

David Clifford Long

Krishna Gandhi Sachdev

Voya Rista Markovich

Donald Rene Wall

Robert W Nufer

Brenda Lee Peterson

Paul Walter Martin, Iii

George Frederick Walker

Jon Alfred Casey

James Marc Leas

David Lewis Gardell

Miguel Angel Jimarez

Lewis Sigmund Goldmann

Lawrence D David

Lisa Jeanine Jimarez

Robert William Pasco

Daniel George Berger

Cynthia Susan Milkovich

Jody John Van Horn

Anthony Mastreani

Tibor L Bauer

Arnold I Baise

Mark R LaForce

Salvatore J Scilla

Robert William Koss

Govindarajan Natarajan

Lester W Herron

Sarah Huffsmith Knickerbocker

Srinivasa S Reddy

Raymond A Jackson

Ajay Prabhakar Giri

Yuet-Ying Yu

Mark G Courtney

Mark A Takacs

Steven M Kandetzke

Dale Curtis McHerron

John Acocella

Daniel P O'Connor

George Czornyj

Renuka S Divakaruni

Paul M Gaschke

Gregory Blair Martin

Vincent P Peterson

Richard A Bates

Ronald J Prilik

Peter A Agostino

Lovell B Wiggins

David R Clarke

Daniel P Kirby

Liang-Choo Hsia

Amy B Ostrander

Amy T Matts

Roger R Schmidt

William Louis Brodsky

Brian Samuel Beaman

Da-Yuan Shih

Thomas Weiss

Raschid Jose Bezama

James A Busby

Benson Chan

Steven G Barbee

Mario John Interrante

Dennis R Barringer

Shaji Farooq

Janusz S Wilczynski

John Patrick Hummel

Harbans S Sachdev

Glenn A Pomerantz

Harvey Charles Hamel

John Joseph Garant

Suryanarayan G Hegde

Srinivasa S N Reddy

Philip L Flaitz

Keith C O'Neil

Wade H White

Robert L Weiss

Jae M Park

Umar M Ahmad

Dennis R Conti

Robert Neal Lang

Jungihl Kim

James Ralph Case

Scott Ira Langenthal

Robert R Shaw

Joseph M Harvilchuck

Hung-Chang W Huang

Srinivasa N Reddy

Terence W Spoor

James M Crafts

Thomas P Moyer

Abbas Behfar-Rad

John E Kozol

Ekkehard F Miersch

Roger Lam

Joseph J Van Horn

Gerald G Advocate, Jr

Laszlo Kando

A device for addition of motive force to a vehicle, with rotor-plate, rotor-arms, rotor permanent magnets, stator-plate, stator columns, stator electromagnets, and battery, cell, or other energy storage device. The device is retro-fittable on existing wheel assemblies, and installation coverts an internal combustion vehicle to a hybrid with electric propulsion.

Machine for augmentation, storage, and conservation of vehicle motive energy

An improved hybrid drive apparatus with a switched reluctance hub motor. The switched reluctance motor eliminates any drag caused by the existing magnetic fields of the motors used in the prior art by turning off the magnetic fields when not being used. It also is cleaner and more efficient to operate, as any magnetic road dust or debris attracted during operation is dropped or repelled when the magnetic fields are turned off. An improved switched reluctance motor may be used, with a stator ring and rotor ring designed so that the low reluctance flux path does not pass through the full diameter of the rotor or rotor bars.

Switched reluctance motor and switched reluctance apparatus for hybrid vehicles

A machine for addition of motive force to a vehicle, with rotor-plate, rotor-arms, rotor permanent magnets, stator-plate, stator columns, stator electromagnets, and battery, cell, or other energy storage device.

Rotor

An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Method of making an electronic package

A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.

Method of assembling an interconnect device assembly

A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Conductive polymer interconnection configurations

A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

Electrical coupling of substrates by conductive buttons

A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.

Method of assembling a land grid array module

The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85&deg; C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/&deg;C. at 100&deg; C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Polymer and ceramic composite electronic substrates

Growing community of inventors

Poughkeepsie, NY, United States of America

Charles Hampton Perry