International Business Machines Corporation

Other

Globalfoundries Inc.

Elpis Technologies Inc.

Charles H Wilson

Richard Stephen Graf

David Justin West

Ho-Ming Tong

Claudius Feger

Michael J Palmer

Alphonso Philip Lanzetta

Teresita Ordonez Graham

Kurt R Grebe

Linda C Matthew

Helen L Yeh

John J Liutkus

Jay F Leonard

Nelson R Tanner

Robert M Smith

Jason P Ritter

Joseph K V Comeau

John Jay Maloney

Gerald J Scilla

Adele M Mahoney

Byung Kon Min

Sintered connection structures and methods of manufacture are disclosed. The method includes placing a powder on a substrate and sintering the powder to form a plurality of pillars. The method further includes repeating the placing and sintering steps until the plurality of pillars reach a predetermined height. The method further includes forming a solder cap on the plurality of pillars. The method further includes joining the substrate to a board using the solder cap.

Method of manufacturing chip-on-chip structure comprising sinterted pillars

Chip-on-chip structure and methods of manufacture

Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.

IC structure with angled interconnect elements

Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.

Embedded heat spreader with electrical properties

A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

Quad flat no-lead chip carrier with standoff

A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging

Quad flat no-lead chip carrier with stand-off

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Coated means for connecting a chip and a card

Method of applying flex tape protective coating onto a flex product

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Flex tape protective coating

An image projection system having a built-in mechanism for changing unframed transparencies comprises a frame, a source of illumination, a projection lens, a stage mounted to the frame for positioning a transparency thereon for view, delivery means for gripping and slidingly moving an unframed transparency along the surface of said stage, a magazine holding a stack of unframed transparencies for insertion into the frame adjacent to said stage, feed means for feeding the uppermost transparency from a stack of transparencies in the inserted magazine, and suitable drive means. A second magazine and second feed means can be included in the system for bedirectional changing of unframed transparencies. An electrical logic circuit interfacing with a control module can be included in the system for control. The mechanism for changing unframed transparencies can be isolated and built in a detached unit for use with a conventional image projector which does not have such a built-in mechanism.

Image projection system

Apparatus and method for providing a standard telephone with localized calculating and read-out capabilities. Miniaturized electronic calculator circuits are integrally mounted within a standard telephone chassis and operatively share use of the telephone keyboard selector buttons with the existing telephone circuits. Input stimuli applied to the push-button selector keys are simultaneously converted into touch-tone dialing information for the telephone circuits and into digital information for the calculator circuits. A plurality of calculator function input keys supplement the shared standard telephone keyboard and provide function information input capability to the calculator circuits. Easily operated switches enable either independent or simultaneous use of the telephone and/or the calculator circuits. A numerical display panel mounted on the face of the telephone chassis provides visual read-out capability for the calculator and for entered telephone numbers.

Telephone calculator

Growing community of inventors

Essex Junction, VT, United States of America

Charles H Wilson