Battelle Memorial Institute

Battelle Development Corporation

Charles H Henager, Jr

Robert W Knoll

John L Brimhall

Peter Maclyn Martin

Yongsoon Shin

Wendy D Bennett

William D Samuels

Ralph E Williford

John P Hirth

A durable coating made up of superimposed microlayers of preselected materials, and a method of making and utilizing such a coating. In one embodiment of the invention, at least 200 microlayers of at least one transparent material, having a thickness of less than 50 nms are superimposed in a sequential manner so as to obtain a desired arrangement between the layers. This structure then forms a transparent coating that has strength characteristics that are substantially greater than the strength of a layer of the coating material alone.

Nanostructured thin film optical coatings

Disclosed herein are aluminide coatings. In one embodiment coatings are used as a barrier coating to protect a metal substrate, such as a steel or a superalloy, from various chemical environments, including oxidizing, reducing and/or sulfidizing conditions. In addition, the disclosed coatings can be used, for example, to prevent the substantial diffusion of various elements, such as chromium, at elevated service temperatures. Related methods for preparing protective coatings on metal substrates are also described.

Aluminide coatings

According to the present invention, a joined product is at least two ceramic parts, specifically bi-element carbide parts with a bond joint therebetween, wherein the bond joint has a metal silicon phase. The bi-element carbide refers to compounds of MC, M,C, M,C and combinations thereof, where M is a first element and C is carbon. The metal silicon phase may be a metal silicon carbide ternary phase, or a metal silicide.

Joined ceramic product

According to the method of the present invention, joining a first bi-element carbide to a second bi-element carbide, has the steps of: (a) forming a bond agent containing a metal carbide and silicon; (b) placing the bond agent between the first and second bi-element carbides to form a pre-assembly; and (c) pressing and heating the pre-assembly in a non-oxidizing atmosphere to a temperature effective to induce a displacement reaction creating a metal silicon phase bonding the first and second bi-element carbides.

Method of joining ceramics

This invention is directed to a process for forming noninterwoven dispersed particulate composite products. In one case a composite multi-layer film product comprises a substantially noninterwoven multi-layer film having a plurality of discrete layers. This noninterwoven film comprises at least one discrete layer of a first material and at least one discrete layer of a second material. In another case the first and second materials are blended together with each other. In either case, the first material comprises a metalloid and the second material a metal compound. At least one component of a first material in one discrete layer undergoes a solid state displacement reaction with at least one component of a second material thereby producing the requisite noninterwoven composite film product. Preferably, the first material comprises silicon, the second material comprises Mo.sub.2 C, the third material comprises SiC and the fourth material comprises MoSi.sub.2.

Process for producing dispersed particulate composite materials

Stress-induced deformation, and the damage resulting therefrom, increases with film thickness. The overcoming of excessive stress by the use of the Si-Al-N film material of the present invention, permits the formation of thick films that are necessary for certain of the above described applications. The most likely use for the subject film materials, other than their specialized views as an optical film, is for microelectronic packaging of components on silicon substrates. In general, the subject films have excellent adherence to the underlying substrate, a high degree of hardness and durability, and are excellent insulators. Prior art elevated temperature deposition processes cannot meet the microelectronic packaging temperature formation constraints. The process of the present invention is conducted under non-elevated temperature conditions, typically 500.degree. C. or less.

Thick, low-stress films, and coated substrates formed therefrom, and

Stress-induced deformation, and the damage resulting therefrom, increases with film thickness. The overcoming of excessive stress by the use of the film material of the present invention, permits the formation of thick films that are necessary for certain of the above described applications. The most likely use for the subject film materials, other than their specialized views as an optical film, is for microelectronic packaging of components on silicon substrates. In general, the subject Si-Al-O-N films have excellent adherence to the underlying substrate, a high degree of hardness and durability, and are excellent insulators. Prior art elevated temperature deposition processes cannot meet the microelectronic packaging temperature formation constraints. The process of the present invention is conducted under non-elevated temperature conditions, typically 500# C. or less.

Thick, low-stress films, and coated substrates formed therefrom

A joint of beam and column-type members comprising essentially concrete of the type wherein intersecting elongate members of reinforcing steel or the like, confined with supporting members in the form of reinforcing hoops, stirrup-ties, supplementary crossties, or the like in the joint region, provide sufficient strength and ductility in the joint to withstand satisfactorily a predetermined amount of reversed flexure. A special concrete mix is prepared with fibers having a modulus of elasticity of at least about 20 million psi substantially uniformly distributed therein with an average spacing between fibers of up to about 0.3 inch and in a quantity sufficient to provide at least a predetermined flexural strength, and the joint is formed with said concrete mix and such intersecting elongate members, the number of said supporting members in the joint region being less than are required to provide said sufficient strength and ductility with concrete not containing any such fibers. The number of said supporting members may be zero. The special concrete mix may be extended into a region beyond the joint region in at least one of the beam and column-type members with stirrups or stirrup-ties provided around the elongate members in the extended region, the number of said stirrups or stirrup-ties being less than are required to provide the necessary strength and ductility in said region with concrete not containing any such fibers.

Growing community of inventors

Kennewick, WA, United States of America

Charles H Henager, Jr