Cisco Technology, Inc.

Charles H Casale

Mudasir Ahmad

Steven C Bird

Danlu Tang

Varoujan Malian

Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (&#x3bc;Via) having a conductive dome disposed above the outer layer pad of the &#x3bc;Via. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Conductive dome probes for measuring system level multi-GHZ signals

A fixture is provided for use in connection with a circuit board tester. The fixture can move the unit under test (UUT), against the urging or a set of springs, to a first position in which the UUT contacts all probes of the tester, for performing a first set of tests. A partial vacuum is created in the region near the probes to permit atmospheric pressure to move the UUT to the first position. A movable or actuateable limiting member is moved to a position which can engage a fixture member in a manner such that, upon movement of the UUT in a direction away from the probes, when the vacuum is released, the amount of movement is limited, to position the UUT to contact only the taller probes. The actuator may engage any of various parts of the fixture, or a pocket found therein, including support plates or lids, or may contact a surface of the UUT.

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San Jose, CA, United States of America

Charles H Casale