Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Charles Frederick Schweitzer

Jay DeAvis Baker

Brenda Joyce Nation

Lakhi Nandlal Goenka

Delin Li

Robert Edward Belke

Lawrence LeRoy Kneisel

Daniel Phillip Dailey

Andrew Zachary Glovatsky

Michael George Todd

Myron Lemecha

Achyuta Achari

Richard Keith McMillan

Peter Joseph Sinkunas

Zhong-You Joe Shi

Mark David Miller

Peter Langer

Stephen Fuks

Zhong-You (Joe) Shi

Karen Lee Chiles

Tianmin Zheng

Michael Bednarz

Lakhi N Goenke

Walter Kuzma Stepanenko

Jason Bullock, Legal Representative

Cindy Maria Rutyna

Shona Bullock, Legal Representative

William Zhang

Raymond Eric Foster

Oleg Yurievich Gusikhin

Rexanne Michelle Owen

A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().

System and method for mounting electronic components onto flexible substrates

A method to compile images and data created on different software platforms into a platform-independent image begins when a PCB assembler utilizes a VRML interface to make a request to show an image of a PCB or any part of a PCB. The request is sent to a WWW server, which in turn, contacts a database interface, such as CGI. The requested image data is stored on at least one external database and is likely comprised of many individual elements created on many different software platforms, such as Gerber or CAD. The database interface retrieves the requested image data from the external databases and funnels it to the PCB assembler via the WWW server. Finally, the VRML interface software compiles all of the multi-platform data and generates a new, software- and processor-independent image.

VRML interface software for image and data compilation

An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Integrated light and accessory assembly

The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.

Non-contact optical system for production testing of electronic assemblies

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

System and method for repairing flex circuits

An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

Environmentally-sealed electronic assembly and method of making same

An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.

Method for protecting electronic components

A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of 'bus' conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.

Method of making a three-dimensional part with buried conductors

Growing community of inventors

Northville, MI, United States of America

Charles Frederick Schweitzer