Ppg Industries Ohio, Inc.

Charles F Kahle

Stuart Damon Hellring

Gregory J McCollum

Noel Rawle Vanier

Truman F Wilt

Cheng-Hung Hung

Yuzhuo Li

Raphael O Kollah

Brian K Rearick

Timothy A Okel

John W Burgman

Luciano M Parrinello

Carol L Knox

Peter Lawrence Votruba-Drzal

Justin Jonathan Martin

Qunhui Guo

David B Asay

Ran Yi

Paul L Benenati

Charles T Hill

Jason Keleher

Anand K Atmuri

Colin P McCann

Randall D Rogers

Larry E Lipko

Peter M Nowakowski

Joseph P Kovacs

Gregory J Mccollum

Supercapacitor electrodes comprising active charge supporting particles, graphenic carbon particles, and a binder are disclosed. The active charge supporting particles may comprise activated carbon. The graphenic carbon particles may be thermally produced. The electrodes may further comprise electrically conductive carbon.

Supercapacitor electrodes including graphenic carbon particles

The present invention is directed to methods of separating a fluid emulsion stream into a hydrocarbon stream and an aqueous stream, by contacting the stream with a microporous membrane to yield a hydrocarbon product stream and an aqueous product stream. The membrane comprises a substantially hydrophobic, polymeric matrix, and substantially hydrophilic, finely divided, particulate, substantially water-insoluble filler distributed throughout the matrix. The polymeric matrix has a mean pore size less than 1.0 micron, and the purities of the product streams are independent of the flux rate of the aqueous product stream and the pore size of the membrane.

Fluid emulsion purification processes using microporous materials having filtration and adsorption properties

A water resistant coating composition for ink jet recordable substrates having a pH of less than 7, which includes:

Ink recordable substrate coating composition having a pH less than 7

This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization (&ldquo;CMP&rdquo;) of semiconductor and other microelectronic substrates.

Silica-based slurry

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Pittsburgh, PA, United States of America

Charles F Kahle