General Electric Company

Charles Edward Baumgartner

Robert Stephen Lewandowski

Lowell Scott Smith

Douglas Glenn Wildes

David Martin Mills

Frederic Lanteri

George Charles Sogoian

Jean-Francois Gelly

Katherine D Hamly

Ching-Yeu Wei

Bruno Hans Haider

William Andrew Hennessy

Matthew Frank Niemeyer

Bradley R Karas

Lisa R Scott

Serge Gerard Calisti

Robert J Wojnarowski

Charles Gerard Woychik

Kevin Matthew Durocher

Slawomir Rubinsztajn

James Alfred Day

Robert Gideon Wodnicki

Patricia Chapman Irwin

Donald A Bolon

Michael C DeJule

David A Chartrand

David Francis Fobare

Petrus Joannes Joseph Moeleker

Christopher James Kapusta

John Eric Tkaczyk

William Hullinger Huber

Kenneth Paul Zarnoch

William Edward Burdick, Jr

Arnold Factor

Rayette Ann Fisher

John Raymond Krahn

Warren Lee

Reinhold Bruestle

Steinar Bjaerum

Tunc Icoz

Jeffrey Jon Shaw

Alan Tai

Chester Frank Saj

James J Carroll, Sr

Jessica Lynn Abraham

Bjornar Sten-Nilsen

Svein Bergstoel

Rolf Johannessen

Christopher Stephen Yetter

Stephen Royal Kaiser

Stephen Edwardsen

Paul Justin Janiszewski

Haleh Ardebili

Jamie M Gutmann

John L Currier

James Paul Gallo, Jr

Thomas Wayne Hovatter

Trym Eggen

A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a plurality of kerfs. The single crystal piezoelectric material comprises a carrier layer. The kerfs are filled with a kerf filling material to form a single crystal composite and the carrier layer is removed. At least one matching layer is attached to the single crystal composite, and dicing within the kerfs is accomplished to form separate acoustical stacks from the single crystal composite.

Method for forming an acoustical stack for an ultrasound probe

A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Methods of fabricating ultrasonic transducer assemblies

An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Ultrasound acoustic assemblies and methods of manufacture

A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

Tileable sensor array

An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Ultrasound transducer and method for manufacturing an ultrasound transducer

An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

System and method for actively cooling an ultrasound probe

The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60&#xb0; C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue. This may result in an enhancement of ultrasound transmission efficiency between the lens of an ultrasound probe comprising such a composition and the patient.

Silicone rubber compositions comprising bismuth oxide and articles made therefrom

A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.

Ultrasound transducer with improved acoustic performance

An acoustical stack for an ultrasound probe comprises a piezoelectric layer having top and bottom sides and a plurality of matching layer sections forming a matching layer structure. Each of the matching layer sections comprises a spring layer comprising a first material and a mass layer comprising a second material that is different than the first material. The spring layer within the matching layer section that is positioned closest to the piezoelectric layer is thinner than the spring layer within the other matching layer sections.

Method for forming a matching layer structure of an acoustic stack

An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface-with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region. The plurality of circuit structures are configured to provide a second wiring pattern including at least some of the electrical connections formed between the circuit structures, extending from one or more of the first wiring patterns to multiple of the transducer elements.

Ultrasound probe assembly and method of fabrication

A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.

Method for forming a composite structure of backing material for use in a transducer assembly

A method for manufacturing an acoustical stack for use within an ultrasound transducer comprises using a user defined center operating frequency of an ultrasound transducer that is at least about 2.9 MHz. A piezoelectric material and a dematching material are joined with an assembly material to form an acoustical connection therebetween. The piezoelectric material has a first acoustical impedance and *at least one of* an associated piezoelectric rugosity (Ra) and piezoelectric waviness (Wa). The dematching material has a second acoustical impedance that is different than the first acoustical impedance and at least one of an associated dematching Ra and dematching Wa. The piezoelectric and dematching materials have an impedance ratio of at least 2. The assembly material has a thickness that is based on the center operating frequency and at least one of the piezoelectric Ra, piezoelectric Wa, dematching Ra and dematching Wa.

Method for optimized dematching layer assembly in an ultrasound transducer

A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.

Transducer assembly with z-axis interconnect

An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

Method of manufacturing ultrasound transducer device having acoustic backing

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Schenectady, NY, United States of America

Charles Edward Baumgartner