Leland Stanford Junior University

Applied Materials, Inc.

Transfer Devices Inc.

Charles Daniel Schaper

Douglas W Young

Hooman Bolandi

Thomas Kailath

Khalid El-Awady

Khalid A El-Awady

A method of forming a master from smaller originals is provided for use in replicating molecular transfer lithography (M&#xd7;L) templates, cured polymer films for imprinting molds or cured polymer films for photonic applications. A coating layer on a base substrate is successively patterned in two or more areas using dissoluble conformal templates created from original master patterns, wherein areas not being patterned with a template at any given stage of the process are protected with photoresist and templates applied to open areas also partially overlap the resist-protected areas. Overlapping minimizes seam formation in the overall pattern. Templates have etch-resistant functional material that adheres to the coating layer on the base substrate. After dissolving the template to leave only the functional material in the pattern of the original master, etching of the coating layer transfers the pattern to the etched coating layer of the base substrate.

Method of forming large-area masters for replication of transfer lithography templates

A system and method to implement a molecular transfer lithography process is described. A destroyable nanopatterned template coated with functional material is attached to a removable carrier that is held suspended over a substrate, and a shaped pressure pad brings the functional material into contact with the substrate, initiating adhesion of the functional material to the surface of the substrate, and then detracting the pressure pad from the substrate. The substrate with destroyable template and removable carrier is then sent for further processing. In a preferred embodiment, the system and method are used to process a patterned polyvinyl alcohol template coated with a functional material that is thermal adhered to a substrate and after pressing, subjected to a water bath to dissolve away the template and carrier, leaving the functional material patterned on the substrate.

Molecular transfer lithography apparatus and method for transferring patterned materials to a substrate

A method for the duplication of microscopic patterns from a master to a substrate is disclosed, in which a replica of a topographic structure on a master is formed and transferred when needed onto a receiving substrate using one of a variety of printing or imprint techniques, and then dissolved. Additional processing steps can also be carried out using the replica before transfer, including the formation of nanostructures, microdevices, or portions thereof. These structures are then also transferred onto the substrate when the replica is transferred, and remain on the substrate when the replica is dissolved. This is a technique that can be applied as a complementary process or a replacement for various lithographic processing steps in the fabrication of integrated circuits and other microdevices.

Replication and transfer of microstructures and nanostructures

A method for the fabrication of patterned devices, in which a latent image is initially formed in a photosensitive material on a carrier, and the exposed material containing the latent image is physically transferred to a substrate before processing. Physical transfer is enhanced by the appropriate selection of coating surface properties and additional coating layers, and by processing steps, such as heating and UV exposure, to promote adhesion to the substrate and detachment from the carrier.

Molecular transfer lithography

A thermal cycling module for thermally processing a substrate has a thermally-conductive support structure with a planar first side and a second side with a plurality of recesses. A heater is disposed on the first side of the support structure and a fluid distributor positioned beneath the second side of the support structure to direct a coolant onto the support structure to decrease the temperature of the substrate. The fluid distributor may have a plurality of rotatable arms and a plurality of nozzles attached to each arm.

Thermal cycling module

A module for thermally processing a substrate has a plurality of thermally-conductive heating elements supported in position within a plane. Resistive heaters in the form of cartridge heaters are in thermal contact with the heating elements. Multiple zones are enabled by physical separation of the heating elements that constitute the thermal processing plate. A cooling plate is positioned in proximity to the backside of the heating elements and can be driven into thermal contact with the upper heated plate when cooing is desired.

Temperature processing module

A control system and method for variable ramp rate operation of a heater or integrated heating and cooling plate is provided. The control system obtains a calibration signal for a specific thermal cycling profile and for a specific heater, by exposing a calibration wafer having temperature sensors coupled thereto to a predetermined thermal cycling profile. During the calibration process, the temperature sensed by one or more sensors positioned on the heater, or on a thermally conductive plate coupled to the heater is recorded, as is the signal output to the heater. Preferably the position of the wafer relative to the heating mechanism, and the flow of cooling fluid to the heating mechanism are also recorded as part of the calibration signal. When the calibration signal is executed during production processing, the heating mechanism, fluid flow and/or lift pin position can be adjusted based on feedback from the temperature sensors positioned on the heater or on the conductive plate.

Control system and method for providing variable ramp rate operation of a thermal cycling system

A heater is provided for use in substrate processing. In a first aspect, the heater is formed from a heater plate including an upper surface having at least one recess formed therein, a heater element wire disposed within the at least one recess and an electrically insulating and thermally conductive material disposed within the at least one recess so as to electrically insulate the heater element wire from the heater plate. Preferably a plurality of recesses are formed within the upper surface, a heater element wire is disposed within each recess and an electrically insulating and thermally conductive material is disposed within each recess so as to electrically insulate the heater element wire within each recess from the heater plate. A plurality of heating zones thereby may be formed. The electrically insulating and thermally conductive material preferably comprises a material deposited within the recess so as to embed the heater element wire within the electrically insulating and thermally conductive material. The electrically insulating and thermally conductive material also may comprise a plurality of insulating beads that surround the heater element wire. In a second aspect of the invention, the heater comprises a heater plate including an upper and a lower surface, the lower surface of the heater plate having a plurality of cooling fins or other surface features formed therein so as to increase the surface area of the lower surface. A method for cooling a heater also is provided wherein a lower surface of the heater's heater plate is sprayed with a cooling liquid so as to cool the heater. The temperature of the cooling liquid preferably is decreased gradually from a first temperature to a second temperature so as to cool the heater gradually.

Heater for use in substrate processing

In general, the present invention provides a single thermal cycling module for baking and chilling a substrate, such as a wafer, that is in thermal contact with a foil heater, a heat exchanger, and a radiation heater. The radiation heater thermally heats a fluid contained by the heat exchanger, which in turn, thermally bakes the substrate at a desired temperature. When the radiation heater is deactivated, a fluid circulates through the heat exchanger to chill the substrate. The foil heater assists the baking and chilling phases by elevating the temperature of the substrate when necessary to prevent or regulate temperature fluctuations of the substrate temperature. Both the radiation heater and the foil heater can provide several zones for varying the heat applied across the substrate, and a single fluid temperature is provided to the heat exchanger for both baking and chilling cycles.

Thermal cycling module and process using radiant heat

A thermal cycling module includes an array of thermoelectric devices �36! divided into multiple zones �A, B, C, D! independently controlled by corresponding variable power supplies �56, 58, 60, 62!. The thermoelectric devices �36! provide localized, precise, and rapid control of both heating and cooling, while fluid from one of several fluid supplies �64, 66, 68! provides bulk heating or cooling via a fluid heat exchanger �38!. Sensors �46, 48, 50, 52! provide feedback of temperature or other process parameters to a controller �54! which generates control signals for controlling the power supplies �56, 58, 60, 62!, the fluid supplies �64, 66, 68!, and fluid valves �70, 72! which control fluid flow through the heat exchanger �38!.

Growing community of inventors

Union City, CA, United States of America

Charles Daniel Schaper