Micro-Plate, Inc.

Charles D Eidschun

An electric motor monitor having at least one sensor in electrical communication with a memory device and a motor. The memory device is configured to establish a performance baseline of the motor throughout its workload. The signal processing incorporates a memory device such as a microcomputer and/or a programmable logic controller configured to determine the work being performed by the motor by comparing the baseline performance of the motor throughout its work load to at least, the armature amperage of the motor. A wireless system transmits an operating motor's work parameters including, but not limited to, amperage, temperature, vibration, sound, rotation, power, moisture and/or voltage data, to a mobile or fixed base receiver. Data is accessible and viewable in real time. Alerts based on user-defined thresholds of the sensors are sent to an electronic device such as a tablet, a computer, and/or a smart phone.

Electric motor monitor

Disclosed is a method and apparatus for positioning a pair of opposed brush assemblies in a gap defined by end baffles between process chambers. The brushes have a plurality of offset bristle clusters secured to a header, and the header is preferably angled so that the brushes will have a wiping action as a workpiece such as the printed circuit board passes between the bristles. A pair of brushes are employed with the opposed ends in overlapping relationship providing a wiping-type gate, and which permits the entrained fluid to drip down the bristle hairs and into the chamber from which the workpiece such as a printed circuit board is being removed. Optionally the brush bristles can be angled upwardly to incite a gravity assist for the entrained fluid dripping down toward the header of the brush and into the process tank.

Brush seal and method

Disclosed is a plating module and method in a cell which has linearly spaced vertical anodes, and intermediately positioned spargers which can be angularly adjusted with their nozzles impinging directly or at an acute angle on the printed circuit boards positioned at a mid-point in each cell. The printed circuit boards are suspended in clamped relationship to a cathode bar. The cathode bar, in turn, in each unit is coupled to a reciprocating power drive so that the same will move back and forth an optimum distance of at least the spacing between an anode and a sparger, or more particularly, half the spacing between two spargers. The method of the invention contemplates positioning boards to be plated, whether with copper or tin, interiorly of the unit in which the boards are reciprocated in agitation relationship with a plating solution into which an anodes are positioned. The boards are then permitted to reciprocate for a given period of time with a preselected current density. Thereafter they are removed and cleansed, and subsequently positioned into another reciprocatory-type unit for further plating and concluding the cycle. Desirably vertically staggered turbulent free jets are employed angled to accomplish a maximized mass transfer of solution onto the printed circuit boards. In a given embodiment, flow rates can be between 100 and 300 gallons per minute, and current densities between 50 and 200 amperes per square foot.

Plating system and method

Disclosed is the continuous processing of flat workpieces such as printed circuit boards which are suspended by a hanger conveyorized for continuous horizontal transport. More specifically, the conveyorizing passes the workpieces through a plurality of chambers having slotted-end members, one such chamber spraying to remove the photoresist, and another such chamber spraying etching solution to remove the copper cladding. Each station has a slotted cover, and the conveyor suspends a plurality of workpiece holders, each of the holders being joined by chain links of an inert material which overlie the slot in the covers for the chambers. The photoresist chamber is provided with a continuous filter for cntinuously removing and filtering the sludge, thereby reducing the tendency of the removal solution to dilute and become ineffective. All of the chambers are modularized, and the system is compatible with continuous processing for the plating of the printed circuit boards.

Chemical process apparatus

Disclosed is an apparatus which utilizes pipes of different lengths oriented vertically within the fluid of a reservoir which are constantly pressured with a gas source, normally air. Since the pipes are of different length, but the pressure is the same, a different back pressure will occur in the longer pipe as compared to the shorter pipe due to the differing head of fluid which must be displaced by the gas to slowly bubble out of the lower end of the pipes. This pressure differential is then read and the calculations applied, either from a table or constantly monitored through a computer, to measure the pressure differential and calculate the same in terms of specific gravity. Once the specific gravity is known, the back pressure on either the short pipe or the long pipe can be impairedly calibrated, or calculated by an equation having the specific gravity now known, and then determining from that the back pressure which will vary with the height of the fluid in the reservoir. The apparatus includes an enclosure, a dome-like plenum chamber, and pressure chambers which are connected directly to a short pipe and a long pipe. Bleed holes are provided at the top of the pressure chambers of the size of a hypodermic needle to constantly permit the gaseous fluid to flow from the plenum into the long and short tube, and pressure transducers are directly coupled to the pressure chambers to provide a constant read-out.

Specific gravity level gauge and method

Disclosed is a shielded plating cell which will permit continuous transfer of a printed circuit board by a single conveyor, whether chain-type, endless belt, or other unit is employed. The plating head and sparger assembly include a reverse flow chamber in which an anode is positioned thereby reversing the flow of the pressure fluid and creating a venturi effect in an area beneath a pair of shields which flexibly engage the printed circuit board and shield the upper portion as well as environment from the escape of spray. To assist in this shielding, an adjustable choke is provided so that the operator can manually balance the unit by shifting the choke to eliminate any pumping action which occurs in the delta formed at the ends of the printed circuit boards where the shields do not abruptly come together. Additionally, squeegee gates are provided at both ends of the cell to inhibit the migration of plating fluid outside the cell into related processing areas. The method is directed to the provision of those elements which permit balancing the choke to a point where pumping does not occur above the shields. In instances where fine adjustment can be made, the taping of the printed circuit board can be eliminated and the flexible shields serve the masking function as well.

Shielded plating cell and method

Disclosed is a sparger in which there are a plurality of nozzles extending from a vertical sparger pipe, and alternating the vertical sparger pipes or sparger tubes have the nozzles at mid-stations between the adjacent sparger nozzles; with the entire sparger being directed to discharge the fluid to impinge upon the workpiece such as a printed circuit board at an acute angle preferably less than 90.degree.. The resulting pattern on the workpiece is a plurality of footprints, all overlapping a minimum amount on the target area. A further aspect of the invention is directed to having the spargers on one side of the workpiece direct fluid in a downstream direction, whereas the spargers on the opposite side of the workpiece direct the fluid in an upstream direction or contra to the movement of the workpiece such as a printed circuit board. With those spargers directed upstream, a deflector is desirably provided so that any workpieces such as printed circuit boards which cock along the path of motion will be deflected and not cause jamming. The method of the invention is directed to positioning a plurality of spargers in staggered relationship on opposite sides of workpieces, and further orienting the spargers on the opposite sides of the workpiece to discharge their fluids in the opposite direction.

Plating sparger and method

Disclosed is the continuous processing of flat workpieces such as printed circuit boards which are suspended by a hanger conveyorized for continuous horizontal transport. More specifically, the conveyorizing passes the workpieces through a plurality of chambers having slotted-end members, one such chamber spraying to remove the photoresist, and another such chamber spraying etching solution to remove the copper cladding. Each station has a slotted cover, and the conveyor suspends a plurality of workpiece holders, each of the holders being joined by chain links of an inert material which overlie the slot in the covers for the chambers. The photoresist chamber is provided with a continuous filter for continuously removing and filtering the sludge, thereby reducing the tendency of the removal solution to dilute and become ineffective. All of the chambers are modularized, and the system is compatible with continuous processing for the plating of the printed circuit boards. The method shown essentially provides for the continuous processing of printed circuit boards for the removal of photoresist and copper cladding, the sequence being variable. In addition, the printed circuit boards are constrained against lateral sway by providing a plurality of wires pitched steadily downwardly along the path of motion.

Continuous processing of printed circuit boards

Disclosed is a method and apparatus for processing printed circuit boards which do not have a plating buss or plating bar by means of continuously passing the printed circuit boards through a plating cell in which a cathode brush is employed to contact the leads above the tabs while the brush is shielded both above and below in a chamber defined by a pair of shields. Desirably the chamber is pressurized with a gas, normally air, to preclude the migration of solutions such as electroplating solution from the plating cell onto the brush which would become plated itself and lose its effectiveness if contacted by the electrolyte. The plating cell utilizes a sparger and reverse flow chamber and an anode, the anode being positioned essentially in the reverse flow chamber to accomplish the plating. The anode is electrically energized and the cathode is independently energized to provide the current necessary for the plating.

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Clearwater, FL, United States of America

Charles D Eidschun