Other

Agere Systems Inc.

At&t Bell Laboratories

Lucent Technologies Inc.

American Telephone & Telegraph Co., At&t Bell Laboratories

Agere Systems Guardian Corp.

Charles Cohn

Donald Earl Hawk, Jr

Jeffrey Michael Klemovage

Theodore Joseph Sattler

Kevin J Brady

George Addis Baxter

Musawir M Chowdhury

Lakshmendra S Saxena

The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material

A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

Flexible circuit substrate for flip-chip-on-flex applications

An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit package are thus plated with one or more materials. An integrated circuit may be electrically coupled to pad areas on the integrated circuit package. The integrated circuit package can be electroplated by using the one or more current sources coupled to a back plane of the integrated circuit package. The back plane is patterned, wherein the patterning of the back plane occurs after the step of electroplating.

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

A method of manufacturing an integrated circuit package such as a BGA package for use with an integrated circuit chip. The integrated circuit package has a substrate formed with a cavity that exposes a lower conductive level in the package so that connections between the integrated circuit chip and the lower conductive level may be formed to reduce the through holes formed in the substrate. As a result, additional signal line interconnections may be included in the substrate circuit package and/or the size of the integrated circuit chip may be decreased. Each of these may be implemented for enhanced electrical performance. The multiple wire bonding tiers in the substrate may also provide greater wire separation that eases wire bonding and subsequent encapsulation processes.

Method of manufacturing an integrated circuit package

The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may include forming electrically connected plating layers on first and second opposing sides of a substrate and electroplating a contact layer over each of the plating layers using the plating layers. The method further includes removing a portion of the plating layers from the first and second opposing sides while leaving the plating layers under the contact layer.

Method of manufacturing a printed wiring board having a discontinuous plating layer

An integrated circuit package where the integrated circuit chip is mounted on a conductive slug and electrically coupled to the slug. Besides acting as a heat spreader, the conductive slug may also function as a ground plane. This reduces the need for additional conductive layers and plated through hole connections for forming connections to, for example, ground. As a result, the conductive paths in the internal ground planes are not necessarily cut off by the plated through holes used for interconnecting ground connections thus avoiding some of the electrical performance degradation suffered by prior techniques. In addition, the invention allows more signals to be added and/or the size of the integrated circuit chip to be reduced to enhance electrical performance. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.

Integrated circuit package

An integrated circuit package such as a BGA package for use with an integrated circuit chip. The integrated circuit package has substrate with a cavity that exposes a lower conductive level in the package so that connections between the integrated circuit chip and the lower conductive level may be formed to reduce the through holes formed in the substrate. As a result, additional signal line interconnections may be included in the substrate circuit package and/or the size of the integrated circuit chip may be decreased. Each of these may be implemented for enhanced electrical performance. The multiple wire bonding tiers in the substrate may also provide greater wire separation that eases wire bonding and subsequent encapsulation processes.

Integrated circuit package having partially exposed conductive layer

A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate and having a centrally located aperture forming the cavity. The substrate is provided with metal patterns on both planar surfaces thereof, through-plated vias electrically connecting the metal patterns, and a grid array of contact pads on the bottom surface of the substrate, electrically connected to the metal pattern. The structural member provides strength and rigidity to the laminate and is sufficiently thick to enable protection of the IC unit when the cavity is enclosed with the encapsulating polymer. Also disclosed is a method of making the package and a laminate with the cavity, metal patterns and grid pad array for use in assembling the package.

Ball grid array plastic package

A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.

Pin-fin heat sink

This invention is a simple and effective process of producing a plastic pin grid array package having an encapsulated device and a heat sink forming a unitary component of a main planar body of the package. The process includes fabrication of a laminated planar main body having outer plastic sheets provided with metallizations, a metal sheet of high thermal conductivity, and plastic sheets positioned intermediate the outer plastic sheets and the metal sheet, the metal sheet having clearance holes filled with plugs of the material of the intermediate plastic sheets, a plurality of plated-through holes (PTHs) formed in the main body and terminal pins secured in the PTHs. Some of the PTHs contacting the metal sheet and some passing through the plugs in the clearance holes out of contact with the metal sheet. The device, such as an integrated circuit chip, mounted in a recessed cavity in the main body, is in contact with the metal heat-sink. In this manner heat is conducted away from the device by the heat sink and dissipated through the back of the package and those of the terminal pins which are in PTHs contacting the heat sink.

Plastic pin grid array package

An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.

Integrated circuit package using plastic encapsulant

One version of a fire resistant cigarette comprises a charge of tobacco in a low-porosity wrapper substantially free of burn accelerator. The sidestream smoke from this cigarette can be reduced by treating the wrapper with water or ethyl alcohol. Fire resistance is further improved by depositing a linear burn rate reducing substance on the paper from the group consisting of citric acid, magnesium citrate, magnesium acetate, tartaric acid, acetic acid, lactic acid, a sugar, non-fat milk and skim milk. Similar results are achieved with conventional medium to high porosity cigarette papers by treating them with a burn rate reducing substance from the same group. In the case of high porosity cigarette paper, if only a part of the surface area is treated, the porosity of the untreated areas controls tar, nicotine, and carbon monoxide delivery. Still further improvements in sidestream smoke reduction and fire resistance may be achieved by the use of an additional layer of high-porosity cigarette paper in the wrapper.

Treatment of cigarette paper

Cigarette paper is treated by one or the other of two alternative processes. The first alternative process is characterized by the step of coating between 40 and 100% of the surface area of the paper with an aqueous alkali metal silicate solution, the SiO.sub.2 concentration of which ranges from between 12 and 16% for 40% coverage to between 7 and 15% for full coverage. The second alternative process is characterized by two sequential uniform coatings of an aqueous alkali metal silicate solution, the SiO.sub.2 concentrations in each solution ranging from 1.7% to 6%.

A fire resistant cigarette has a wrapper having a coating applied as a dual treatment comprising the separate steps of coating the wrapper with a solution of an alkali metal silicate and coating the wrapper with a pH lowering material wherein the pH lowering material lowers the pH of the alkali silicate. The dual treatment of the cigarette is such that when the cigarette is smoked it produces a smoke which has a pleasing taste and the cigarette is fire resistant.

Cigarettes

A match which is difficult for young children to ignite utilizes a protective coating on the tip of a match head which prevents ignition of the sulfur and potassium chlorate-containing mixture when an attempt is made to strike the match in the usual manner with its stem substantially perpendicular to the friction surface of the matchbook. The protective coating requires a special manipulation of the match whereby its stem is disposed at an angle preferably less than about forty degrees with respect to the friction surface so that the unprotected side of the match head can rub against the friction and ignite the match.

Growing community of inventors

Wayne, NJ, United States of America

Charles Cohn