Nalco Chemical Company

Rodel Inc.

Charles C Payne

Rodney H Banks

Roger H Jansma

John A Romberger

Neil A Marron

Earnest M Kerr

Raymond J Novotny

David A Grattan

Richard C Miller

The concentration of the active ingredient in a rolling oil emulsion can be rapidly determined, and correction of the concentration of the active ingredient can be undertaken by measuring the measuring the amount of light reflected from the emulsion at the peak absorbing wavelength of the dye to obtain a first reflectance value and measuring the amount of light reflected from said emulsion at a wavelength other than the peak absorbing wavelength of the dye to obtain a second reflectance value for at least two different concentrations of the rolling oil in the rolling oil emulsion, establishing a calibration curve, and then monitoring the rolling oil emulsion in like manner. The results may be utilized to feed additional additive to the emulsion, or may be used to feed water into the emulsion system.

Monitoring of rolling oil emulsions

Antistatically modified fixturing cements useful in the polishing of silicon wafers are disclosed. The fixturing adhesives disclosed generally comprise:

Composition for reducing or eliminating static charge in adhesive film

An adhesive composition for a insect-control agent, such as gypsy moth pheromone beads, provides retention and water insolubility to such pesticide upon deposit of an aqueous mixture of such adhesive composition and insect-control agent. The adhesive composition concentrate comprises a salt such as sodium sulfate, an ethoxylated alkylphenol, a polymeric adhesive material, and a high molecular weight acrylate polymer.

Sprayable adhesive for gypsy moth pheromone beads

A colloidal silica slurry comprising: a low metals ammonium-stabilized silica sol having the following characteristics: SiO.sub.2 present in the range between about 15 to about 50 weight percent; a pH in the range between about 8.5 to about 11.3; a particle diameter in the range between about 4.0 to about 130 nm; aluminum, as Al, present in an amount less than about 100 ppm, based on SiO.sub.2 ; iron, as Fe, present in an amount less than about 50 ppm, based on SiO.sub.2 ; potassium, as K, present in an amount less than about 25 ppm, based on SiO.sub.2 ; and sodium, as Na, present in an amount less than about 500 ppm, based on SiO.sub.2 ; and a bactericide, a polishing rate accelerator which differs from the bactericide, and/or a sodium chlorite or sodium hypochlorite biocide. Optionally, a fungicide may also be added to the colloidal silica slurry to inhibit fungi growth.

Low sodium, low metals silica polishing slurries

Superiority in retained slide angle of antiskid paper is achieved by spraying the paper with a composition of matter consisting essentially of an acrylamide, glycerine, balance antiskid aqueous silica sol.

Antiskid paper with enhanced friction retention

Composition of matter and method of cleaning silicon wafers; the composition of matter is an aqueous solution of potassium hydroxide and a nitrogen-containing compound, preferably tetramethylammonium hydroxide. The wafer is immersed in the solution, rinsed and dried.

Cleaning of silicon wafers with an aqueous solution of KOH and a

A concentrated lapping composition having the following makeup:

Lapping slurry compositions with improved lap rate

A lubricating composition for use in slicing or cutting silicon wafers. The composition includes a soap, a phosphorous containing compound, and an ethylene oxide-propylene oxide polymer. The phosphorous compound is a low temperature, extreme pressure lubricant. The ethylene oxide propylene oxide polymer is a high temperature, extreme pressure lubricant. Suitable soaps include C6-C18 fatty acids reacted with triethanolamine or aminoethanolamine. Additionally, biocides or fungicides may be added. Also an antifoam and a complexing aid such as EDTA may be used.

Lubricating fluids for slicing silicon ingots

Improved lapping compositions are disclosed which contain;

Concentrated lapping slurries

A composition useful in polishing silicon wafers and like materials which comprises an aqueous colloidal silica sol or gel and from 0.1-5% by weight based on the SiO.sub.2 content of the sol or gel of piperazine.

Aqueous silica compositions for polishing silicon wafers

In a process of manufacturing discrete, ceramic fiber insulation products, the steps of:

Prevention of silica migration in thermal insulation with water-soluble

It is now known that molecular sieve cracking catalysts used in fluid catalytic cracking units which have been contaminated with such metals as vanadium and nickel can be restored by contacting such contaminated catalysts with antimony-containing compounds and then subsequently subjecting the thus-treated catalysts to elevated temperatures and an oxygen-containing gas whereby revitalization is achieved. The above process can be improved by using as a source of antimony oxide an oil-in-water emulsion of an aqueous antimony sol.

Oil-dispersible antimony oxide sol dispersed as an oil in water emulsion

A method of producing iron acetate coated silica sol which comprises the steps of passing a mixture of ion-free colloidal silica and an inorganic iron salt in contact with a strong base anion exchange resin in the acetic acid salt form under conditions whereby the iron salt is converted to the iron acetate and is coated on the silica sol, thereby producing an iron acetate coated silica sol.

Preparation of a ferric acetate coated silica sol by selective anion

Semi-conductors can be polished with greater efficiency using as a polishing agent a blend of colloidal silica or silica gel, a water-soluble amine and a water-soluble quaternary ammonium salt or base.

Silica sol compositions for polishing silicon wafers

New alumina coated silica sols are produced by a method which comprises mixing a concentrated deionized silica sol with concentrated solutions of trivalent acid aluminum salts, heating this premix to at least 90.degree. C. for 1-15 minutes to form an alumina reacted silica sol solution, cooling this reacted silica sol solution to form a cooled alumina reacted silica sol solution, diluting with deionized water to about 10 weight percent solids, exposing this diluted alumina reacted silica sol to ultrafiltration through a membrane having a molecular weight cutoff of about 30,000, adding distilled or deionized water to the diluted alumina reacted silica sol during ultrafiltration to wash dissolved salts from this salt solution forming a diluted alumina-coated silica sol having a pH between about 4-5 and a conductivity between about 2,000-4,000 micromhos, concentrating this dilute alumina-coated silica sol to at least 30 weight percent solids, thereby obtaining a stable alumina-coated silica sol.

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Aurora, IL, United States of America

Charles C Payne