International Business Machines Corporation

Charles C Bureau

Kang-Wook Lee

Eric Duchesne

Isabelle Paquin

Dragoljub Veljanovic

Paul Stephen Andry

Marc Adam Bergendahl

Kamal Kumar Sikka

Vijayeshwar Das Khanna

Hiroyuki Mori

Yang Liu

Ravi K Bonam

Dale Curtis McHerron

Isabel De Sousa

Maryse Cournoyer

Pascale Gagnon

Catherine Dufort

Dishit Paresh Parekh

A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

Direct bonded heterogeneous integration silicon bridge

An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Enhanced cleaning for water-soluble flux soldering

Growing community of inventors

Bromont, Canada

Charles C Bureau