Apple Inc.

Google Inc.

Motorola Mobility LLC

Other

Charles B Woodhull

Tang Yew Tan

David A Pakula

Bryan Patrick Kiple

Peter N Russell-Clarke

Michael Benjamin Wittenberg

Jonathan P Ive

Duncan Robert Kerr

Bartley K Andre

Richard P Howarth

Eugene Antony Whang

Christopher J Stringer

Martha Evans Hankey

Rico L Zorkendorfer

Daniele De Iuliis

Jody R Akana

Daniel J Coster

Matthew Dean Rohrbach

Jeremy D Bataillou

Julian Hoenig

Shin Nishibori

Ashutosh Yugesh Shukla

Jason S Sloey

Thomas Johannessen

Paul M Pierce

Jiri Slaby

Roger William Ady

Karl R Voss

Eric Steven Jol

Albert John Golko

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Ian A Spraggs

Scott P Porter

John B Ardisana, Ii

Ruchir M Dave

Masashige Tatebe

James Tanner

Richard Walter Heley

Napthaneal Yuen Tan

John Murray Thornton, Iii

Julie Hanchak-Connors

Sawyer Issac Cohen

Michael Coleman

Christopher D Prest

Douglas Joseph Weber

Dale N Memering

Jared Mitchell Kole

Michael Kane Pilliod

Kelvin Kwong

Paul Choiniere

Rachael Elizabeth Roberts

Warren Jones

Michael P Coleman

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Components of an electronic device and methods for their assembly

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Double anodized parts

A computing device is described that receives fingerprint data that is generated by at least one sensor of the computing device and determines, based on a comparison of the fingerprint data with data associated with a fingerprint of an authorized user of the computing device, whether to authorize access to one or more applications that are executable by the computing device. Responsive to determining that access to the one or more applications is authorized, the computing device determines a gesture indicated by the fingerprint data, selects, based on the gesture, an application of the one or more applications as a selected application, and outputs, for display, a graphical user interface of the selected application.

Multi-function button for computing devices

Anodizing resistant components and methods of use thereof

The disclosed embodiments include enclosures for electronic devices formed from RF-transparent, toughened glass materials, such as chemically hardened alkali-aluminosilicate glass. For example, according to the disclosed embodiments, an enclosure for an electronic device may be formed from a plurality of enclosure components joined together along corresponding interfaces to establish an enclosure structure, or alternatively, may be formed from a single enclosure component. In some aspects, the enclosure structure may have corresponding first and second ends, the enclosure structure may have corresponding first and second surfaces, and the second surface may be exposed to an environment. The enclosure may also include first and second cap components disposed at corresponding ones of the first and second ends.

Glass enclosures for electronic devices

Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.

Combined audio jack and mobile electronic device enclosure

Growing community of inventors

San Francisco, CA, United States of America

Charles B Woodhull