Kryotech, Inc.

At&t Global Information Solutions Company

Delta Design, Inc.

Charles B Wall

Terry Craps

Cynthia M Barnes

Warren W Porter

Johnston W Peeples

Charles R Schmidt, Jr

Matthew F W Brown

Robert DiGiacomo

An apparatus for controlling the temperature of an electronic device under test includes a thermal head having a temperature controlled surface for making thermal contact with the electronic device. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the thermal head. A refrigeration system is connected in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto. The refrigeration system includes a metering valve operative to regulate introduction of the refrigerant fluid into the thermal head. A controller is operative to control the metering valve for maintaining a predetermined temperature at the temperature controlled surface.

Apparatus and method for controlling the temperature of an electronic device under test

An apparatus and method for controlling the temperature of an integrated circuit device includes a refrigerant system having a coolant loop containing refrigerant, an evaporator, a compressor, and a condenser. The condenser has a variable speed fan controlled to maintain the temperature of the refrigerant at a predetermined value. In a refrigeration system used to cool an integrated circuit device, a method for controlling refrigerant pressure by comparing the refrigerant temperature at a predetermined location to a predetermined value and varying the cooling applied to the condenser.

Apparatus and method for controlling the temperature of an integrated circuit device

An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling the device. The integrated circuit device is mounted in a socket having socket pins that extend through a heater board forming one side of the device to projecting exposed external end portions. A heating element in the form of a polymer thick film resistor is deposited on the heater board on the inside of the chamber in the vicinity of the socket pins. The heating element is activated as necessary by a thermostatic control circuit to maintain the temperature of the exposed external end portions of the socket pins above a predetermined threshold to prevent moisture condensation on the projecting portions of the pins.

Method and apparatus for cooling an integrated circuit device

A cooling system for a computer system which includes at least one component which generates substantial thermal energy. The cooling system includes a high efficiency heat exchanger formed of a thermally conductive material which is attached to the heat generating component. This heat exchanger comprises a hollow body formed of a thermally conductive material for attachment to the heat generating component, a coolant inlet provided through the wall of the hollow body for providing cooling air from received from an air compressor to the interior of the heat exchanger, and a coolant outlet provided through the wall of the hollow body for providing egress of cooling air from the heat exchanger. Within the hollow body, the exchanger includes a a corrugated metal fin which is periodically lanced to provide for the passage of cooling air through the fin. The metal fin occupies substantially all of the cavity within the heat exchanger's hollow body and is oriented such that the corrugations in the fin are positioned between the heat exchanger's inlet and outlet, providing maximum contact between the cooling air and the surface area of the metal fin.

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Lexington, SC, United States of America

Charles B Wall