Vought Corporation

Charles B Evans

John D Fenton

Bonner W Staff

Disclosed is a means and method for evaluating a bond between first and second structures bonded together by an intermediate layer of adhesive. Means are provided for transmitting a pulse of ultrasonic wave energy into the bonded structures whereby a first reflected pulse may be reflected from a first surface of the first structure, a second reflected pulse reflected from the layer of adhesive, and a third pulse possibly reflected from the surface of the second structure adjacent the adhesive layer. Circuit means are provided for sensing the first, second, and third reflected pulses and for providing an indication of the quality of the bond by comparing the amplitudes of the reflected pulses and determining if the ratios lie within predetermined ranges.

Apparatus for evaluating a bond

Disclosed is an apparatus and method for evaluating a bond between first and second structures bonded together by an intermediate layer of adhesive. Apparatus is provided for transmitting a pulse of ultrasonic wave energy that has a duration at least as short as 1.5 wave cycles into the bonded structures whereby a first reflected pulse may be reflected from a first surface of the first structure, a second reflected pulse reflected from the layer of adhesive, and a third pulse possibly reflected from the surface of the second structure adjacent the adhesive layer. Circuits are provided for sensing the first, second, and third reflected pulses and for providing an indication of the quality of the bond by comparing the amplitudes of the reflected pulses and determining if the ratios lie within predetermined ranges.

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Arlington, TX, United States of America

Charles B Evans