Universal Instruments Corporation

Delaware Capital Formation, Inc.

Charles Andrew Coots

John E Danek

Koenraad Alexander Gieskes

Andrew Zalesski

James E York

Stanislaw Wladyslaw Janisiewicz

John I Burgin, Jr

Michael J Gorenflo

George D Eck

Michael Joseph Kane

John Joseph Pichura

Steven C Bessette

Maxim Factourovich

Mark Jonathan Erickson

Damon Scott Ashman

James Daniel Lamuraglia

Charles H Dunlap

A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.

Semiconductor die offset compensation variation

A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.

Feeder system, pick and place machine, and method

An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Flexible assembly machine, system and method

A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder bank system separate from the head, wherein the feeder system includes a first feeder bank and a second feeder bank and a positioning system for moving both the entire first feeder bank and the entire second feeder bank in both a horizontal X direction and a perpendicular horizontal Y direction, wherein the feeder bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product. The entire first feeder bank and the entire second feeder bank of the at least one feeder bank system are each movably located on said component placement machine independently from each other, so that movement of the entire first feeder bank occurs while said component placement machine uses the second feeder bank to assemble said printed circuit board of said first printed circuit board product.

Component placement machine

An apparatus and method for compound angle illumination of items such as electronic components and features on those components that are within a field of view of a camera. Illumination assemblies are provided on opposite sides of the components, where illumination criss-crosses the component and its features. The illumination assemblies are also tilted at a vertical angle relative to the component. Light emitting diodes are used as a light source and, in one embodiment, refracting prisms are provided to refract the light from the LED's to provide the criss-cross illumination.

Method and apparatus for illuminating leads of a component

Disclosed is a tape feeder for use with electronic assembly machines. The feeder simultaneously presents multiple electronic components in a pick up zone for access by a pick up head having a plurality of pick up spindles. The effective feed rate for the electronic components is increased and waiting time for the pick up head is reduced.

Multiple index tape feeder and method

A variable reluctance linear motor has a stator and an armature mounted so as to be movable along the length of the stator. Armature bearings are mounted to the armature via mechanical vibration dampers and contact the stator so that vibrations in the stator are transmitted to the bearings and dissipated in said vibration dampers. A sensor is mounted to the armature for obtaining position data for the armature with respect to the stator. A controller then calculates the phase currents for the motor phases based on the position data and a desired force value. The phase currents are calculated to maintain a minimum normal force between the armature and said stator, thereby further reducing vibrations. A conditional filter is applied when armature is within a predetermined distance from a desired location. The conditional filter, after a time delay, clamps the velocity feedback to a predetermined range and simultaneously reduces the velocity loop gain.

Method and apparatus for vibration reduction/control in a variable

An apparatus including a vacuum nozzle including an elongated inner bore that defines an elongated vacuum conduit that is coaxial with the inner bore; a nozzle tip connected to the end of the vacuum nozzle and adjacent the vacuum conduit; a reciprocally movable sleeve located within the vacuum conduit and retained by the vacuum nozzle and extendable beyond the nozzle tip; and structure for applying a restorative force to the movable sleeve, the structure for applying a restorative force to the movable sleeve being located within the vacuum conduit and in contact with the movable sleeve.

Growing community of inventors

Binghamton, NY, United States of America

Charles Andrew Coots