Advanced Micro Devices Corporation

Charles Anderson

James J Casto

Alexander C Tain

Quang Nguyen

Raj N Master

Paul J Sokolovsky

Mohammad Zubair Khan

Maria G Guardado

Thomas S Tarter

An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270&deg; C.

Organic packages having low tin solder connections

An arrangement and method of reconfiguring a circuit board and package arrangement employs one-time programmable elements on a package to allow a programmable first package arrangement having a first package board and a first integrated circuit to be readily replaced. The first package arrangement was programmed to operate with a first set of operating parameters. The replacement package arrangement, having a second package board and a second integrated circuit, may be substantially identical to the first package arrangement except programmed to operate with a second set of operating parameters different from the first set of op crating parameters. The replacement of the first package arrangement by the second, differently programmed package arrangement, provides a reconfigured circuit board and package arrangement while avoiding the obsoleting of the circuit board.

Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements

A carrier tray is provided for holding a semiconductor device that has a two dimensional array of regularly spaced rows and columns of holes having one and only one pitch and one and only one pocket size. The holes are configured to receive a solder ball from a ball grid array package. The carrier tray can engage at least two differently sized ball grid array packages, thereby avoiding the expense and long lag time associated with designing a new product carrier tray for each new semiconductor device.

Universal carrier tray

An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is positioned on a surface other than the top surface, e.g., a side surface or the bottom surface of the package substrate to render them less conspicuous to unscrupulous suppliers intent on tampering with the package. The information programmed by the fuses may relate to speed or voltage ratings for a microprocessor.

Integrated circuit package incorporating camouflaged programmable elements

A structure and method for protecting encapsulated semiconductor integrated microcircuit dice during shipping. The structure secures the position of the encapsulated die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the packaged dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate encapsulated die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed encapsulated die.

Packaging for encapsulated dice employing EMR-sensitive adhesives

A lead cut and tape attach apparatus (10) for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching tape thereover on the remaining sides of the quad device includes a double-acting punch assembly (34) formed of an inner punch blade (58) and an outer punch (56). There is provided upper and lower cams (68, 78) for actuating the inner punch blade relative to the outer punch so that on a first downward stroke the inner punch blade is extended to cut the leads of the quad device. On a second downward stroke of the punch assembly, the inner punch blade is retracted and the outer punch cuts and attaches the tape.

Growing community of inventors

Los Altos, CA, United States of America

Charles Anderson