Piranha Plastics, LLC

Itt Manufacturing Enterprises, Inc.

Great American Gumball Corporation

3m Innovative Properties Company

Itt Industries, Inc.

Charles Alfred Centofante

Brian S Boothman

Andreas Michael Schremmer

Gerhard Geisemann

A flow dampener for dampening pulsation in a fluid flow includes a body shell, a flexible membrane, and two flow ports. The body shell has an interior surface and an elongate groove formed on the interior surface. The flexible membrane is sealed to the interior surface of the body shell and covers the elongate groove. In some embodiments, the flexible membrane is over-molded onto the body shell. The flexible membrane cooperates with the elongate groove to form an elongate flow path for the fluid flow. The flexible membrane has a thickness in a range from 0.5 mm to 6 mm. As the membrane is flexible, it vibrates as the fluid flows through the elongate flow path, absorbs kinetic energy in the fluid flow, and thereby dampens pulsation in the fluid flow.

Flow dampener in flow measurement system

This specification describes technologies relating to a pump for dispensing precise quantities of fluids. In some implementations, a pump includes a pump head including one or more recesses configured to receive one or more corresponding roller elements; and a pump body including an input port, and output port, a first fluid channel, and a second fluid channel, wherein the first fluid channel is formed in part from rigid walls of the pump body and in part from a semi-rigid membrane positioned on at least a portion of the pump body; wherein the pump head is rotatably coupled to the pump body such that the one or more roller elements interface with the semi-rigid membrane such that during rotation the roller elements compress the semi-rigid membrane to push fluid trapped within the first fluid channel in the direction of rotation.

Fluid pump with pulse reduction

This specification describes technologies relating to a pump for dispensing precise quantities of fluids. In some implementations, a pump includes a rotatable portion including one or more recesses configured to receive one or more corresponding roller components; and a base portion including a fluid channel including an input aperture and an output aperture, the fluid channel being configured to receive the one or more roller components, and a flexible membrane that provides a seal between the roller components and the fluid channel, wherein, the rotatable portion is rotatably coupled to the base portion such that the fluid channel includes one or more portions sealed by the flexible membrane and one or more roller components and wherein rotation of the rotatable portion causes the one or more roller components to traverse the fluid channel pushing fluid trapped within the fluid channel and the membrane in the direction of rotation.

Hemi-toroidal fluid pump

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for dispensing toners. In one aspect, a cap and valve assembly is provided including a movable valve assembly, the movable valve assembly having a first position and a second position; a toner path, which when open is configured to allow toner to flow from a toner container to an output aperture; and an air inlet path, which when open is configured to couple an air source to the toner container; where in a first valve assembly position the toner path and the air inlet path are closed, and in a second valve assembly position the toner path aid the air inlet path are open.

Pump-less toner dispensing cap

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for dispensing toners. In one aspect, a toner dispensing system includes a toner container; a cap and valve assembly coupled to the toner container, the cap and value assembly including: a movable valve assembly, the movable valve assembly having a first position and a second position, a toner path, and an air inlet path, where in a first valve assembly position the toner path and the air inlet path are closed, and in a second valve assembly position the toner path and the air inlet path are open; an air assembly including a first air supply coupled to the air path of the cap and valve assembly and a second regulated air supply coupled to the toner container; and a control assembly for controlling the second air supply.

Pump-less toner dispenser

A valve assembly is disclosed comprising an elongate body comprising a lumen and an output aperture near a distal portion thereof, a plunger positioned in the lumen and movable to a first position and a second position, and a toner path formed at least partially within the lumen and extending from a toner input to a toner path end located proximate the output aperture. When the plunger is in the first position, the output aperture is not fluidly coupled to the toner path. When the plunger is in the second position, the outlet aperture is fluidly coupled to the toner path such that a toner in the toner path can exit the valve assembly.

An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base, over-molding a lid onto at least a portion of the base and a portion of the electronic device, the lid and the base comprising a housing for the electronic device, and over-molding a movable component to a portion of the housing. In another implementation a method for housing an electronic device includes positioning a housing for an electrical device within a first mold cavity of an assembly mold, the housing including a base and a lid, molding a movable component in a second mold cavity of the assembly mold, and attaching the movable component to the housing while both the movable component and the housing are within the assembly mold.

Method of making an electronic device housing

Apparatus and methods for housing an electronic device are provided. In some implementations an apparatus is provided. The apparatus includes a base, an electronic device positioned on the base, and a lid positioned to cover the base and at least a portion of the electronic device. The lid and the base form a housing for the electronic device, the lid including a lid aperture, the lid aperture exposing at least a portion of the electronic device. The apparatus also includes a transparent portion positioned such that a first region of the transparent portion is positioned within the lid aperture and where at least a portion of the electronic device is covered by the transparent portion.

Electronic device housing

An apparatus and methods are provided for housing an electronic device. In one embodiment, an electronic device is positioned on a housing base and a housing lid is over-molded onto at least a portion of the base and the electronic device. An interface of the electronic device remains exposed for coupling to a second electronic device, and the housing base and housing lid form a housing partially encasing the electronic device. In another embodiment, an inset panel can be formed within the housing lid or base, for example, by positioning the panel and the electronic device within a housing base and over-molding a housing lid, while maintaining the inset panel substantially exposed. The inset panel can be formed from a material of a contrasting color to provide, for example, a label region on the housed electronic device.

Insert molding electronic devices

A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.

Electronic device encapsulated directly on a substrate

A PC card for insertion into a slot of a portable computer or other electronic device, has an antenna that allows the electronic device to send and receive data through radio waves. The antenna is moveable from a stowed position wherein most of the antenna lies in the PC card housing, and a first deployed position wherein most of the antenna projects rearwardly through an opening at the rear of the housing so radio waves can be transmitted and received. The antenna can be mounted on a tray that is moveable forwardly and rearwardly into and out of the rear of the housing. The tray can form a smart card-receiving recess that receives a small smart card to enable connection to pads on the smart card so as to provide authorization for communication through a wireless telephone network.

PC card for electronic devices

An adapter to connect either Type I or Type II cards into a PCMCIA compliant PC Card interface on a personal computer. A protective shutter mechanism receives both Type I and Type II cards.

Personal computer peripheral device adapter

A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.

Growing community of inventors

Los Altos, CA, United States of America

Charles Alfred Centofante