General Electric Company

Lumination LLC

Gelcore, LLC

Martin Marietta Corporation

Momentive Performance Materials Gmbh

Ge Lighting Solutions LLC

Charles Adrian Becker

Stanton Earl Weaver, Jr

Alok Mani Srivastava

Holly Ann Comanzo

Anant Achyut Setlur

Mehmet Arik

James Wilson Rose

Thomas Frederick Soules

Thomas Bert Gorczyca

Joseph John Shiang

Donald E Castleberry

Renato Guida

Bernard Gorowitz

Thomas Elliot Stecher

Robert J Wojnarowski

Steven Francis LeBoeuf

Mark Philip D'Evelyn

Jian Wang

William Dwight Gerstler

Venkat Subramaniam Venkataramani

Stephen Daley Arthur

Kanakasabapathi Subramanian

Yunfeng Liu

Steven Jude Duclos

James Thomas Petroski

Samhita Dasgupta

Vinayak Tilak

Xiaoming Yuan

Mathew L Sommers

Jeffrey Bernard Fortin

Yingqi Zhang

Steven Alfred Tysoe

James Claude Carnahan

Saijun Mao

Christopher L Bohler

Robert F Karlicek

Chen-Lun Hsing Chen

Greg Eugene Burkholder

Abasifreke Udo Ebong

Anthony D Pollard

Mark S Logan

Junhui Fei

Josesph Shiang

Rebecca A Bompiedi

A system having an alternating current (AC) driven LED unit, an AC voltage regulator, and a controller is provided. The AC driven LED unit includes a first LED and a second LED coupled in reverse parallel. The AC voltage regulator is operable to receive AC voltage originating from an AC voltage source, regulate the AC voltage according to control signals from the controller, and apply regulated AC voltage to the AC driven LED unit, so as to enable the first LED and the second LED to emit light according to the regulated AC voltage. In addition, a method is provided for driving the LED by regulating the AC voltage. By regulating the AC voltage using the AC voltage regulator, benefits of restraining voltage fluctuations, reducing THD, improving power factor, providing dimming control, and mitigating flicker phenomenon can be achieved.

System and method for driving light emitting diodes

An LED lamp including an LED and one or more phosphors, wherein for each phosphor, a figure of merit (FOM) defined as the product of (incident LED flux)&#xd7;(excitation cross-section of the phosphor)&#xd7;(phosphor material decay time) is less than 0.3. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

Rules for efficient light sources using phosphor converted LEDs

A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

LED illumination device with layered phosphor pattern

A lighting apparatus () comprises a light engine () producing ultra violet radiation. An enclosure () surrounds a radiation generating area of the light engine () to encompass the radiation. At least one wall () of the enclosure () is substantially reflective of the ultraviolet radiation. The enclosure () includes a replaceable top portion () which includes a phosphor portion (). The phosphor portion () is spaced from the radiation generating area of the light engine () by a height of the enclosure ().

Method and apparatus for LED panel lamp systems

An etchant including a halogenated salt, such as Cryolite (NaAlF) or potassium tetrafluoro borate (KBF), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (NaAlF), potassium tetrafluoro borate (KBF), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

Etchant, method of etching, laminate formed thereby, and device

A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes ('LEDs') and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

Flexible interconnect structures for electrical devices and light sources incorporating the same

A light emitting apparatus () includes one or more light emitting diode chips () disposed on a chip support wall () including printed circuitry () connecting with the light emitting diode chips. A heat pipe () has a sealed volume () defined by walls including the chip support wall and at least one additional wall (). The heat pipe further includes a heat transfer fluid () disposed in the sealed volume.

Light emitting diode apparatuses with heat pipes for thermal management

A semiconductor device die () is disposed on a heat-sinking support structure (). Nanotube regions () contain nanotubes () are arranged on a surface of or in the heatsinking support structure (). The nanotube regions () are arranged to contribute to heat transfer from the semiconductor device die () to the heat-sinking support structure (). In one embodiment, the semiconductor device die () includes die electrodes (), and the support structure () includes contact pads () defined by at least some of the nanotube regions (). The contact pads () electrically and mechanically contact the die electrodes (). In another embodiment, the heat-sinking support structure () includes microchannels () arranged laterally in the support structure (). At least some of the nanotube regions are disposed inside the microchannels ().

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

High power LED power pack for spot module illumination

A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.

Structure for protecting air bridges on semiconductor chips from damage

Information is written into a matrix-addressed electroscopic display by means of a writing stylus having a magnetic tip, utilized to attract a moveable plate electrode in a selected one of the display matrix cells. A capacitance detector, connected to sequential ones of the column electrodes of the display via a first multiplexer and to sequential ones of the row electrodes of the matrix display via a second multiplexer, detects the change in cell interelectrode capacitance caused by movement of the moveable plate electrode. The capacitance of each display cell is compared with the data for the output state commanded for that cell, to recognize input data sites programmed by the magnetic writing stylus.

Electroscopic information display and entry system with writing stylus

Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.

High density electronic circuits having very narrow conductors

Method of fabricating high density electronic circuits having very

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Schenectady, NY, United States of America

Charles Adrian Becker