Rca Inc.

P. R. Mallory Co.

Charles A Weaver

Donald J Wierschke

Gunter John

Joseph W Stephens

An apparatus for holding an IC device for tinning the leads in a wave soldering machine is disclosed. The apparatus utilizes a pair of beveled surfaces, one on each side of the lead to be tinned, to limit the extent of penetration of the lead into the molten solder. The beveled surfaces are made of a material which cannot be wet by the molten solder, therefore, surface tension of the solder will tend to limit penetration of the molten solder into the area defined by the beveled surfaces.

Apparatus for holding a part in a wave soldering machine

There is described herein a method of operating an extruder for thermoplastic material to automatically control the output of the extruder. The extruder includes a kneader screw, a hopper having a feed screw for feeding the thermoplastic material in dry particulate form to the kneader screw and an outlet feed screw for removing the plastic material in molten form from the kneader screw. Each of the screws is operated by a separate electric motor. The method includes monitoring the current of the motor for the kneader screw. Variations in the current indicate variations in the opertion of the kneader screw. Upon any variation in the current of the kneader screw motor, the speed of the hopper feed screw and/or the outlet feed screw is varied to compensate for the variation in the operation of the kneader feed screw and return the current to its original value.

Apparatus and method for automatically controlling an extruder for

An improved apparatus for attaching a record matrix to be replicated by electroforming to the cathode of an electroforming device is provided. The apparatus includes a positioning pin which maintains the record matrix center hole concentric to the cathode and to the replicated grooves and a lock knob which effectively holds the center portion of the record matrix in liquid-tight electrical contact with the cathode.

Apparatus for attaching a matrix to an electroforming device and method

In order to provide an improved seal between matrixes and their replicas, as well as eliminating or substantially reducing the problem of premature separation of the replicas from the matrixes, a circumferential spiral groove of a substantially rectangular configuration is cut into the outermost circumferential area of the matrix. The rectangular spiral groove is cut beyond the portion of the matrix which will be used as the molding surface of the stamper. The rectangular groove is substantially larger than the V-shaped groove of audio records and is much larger than the V-shaped grooves used on high density information discs. Because of the larger size and the substantially rectangular geometric configuration of the grooves, the rectangular spiral groove forms a highly effective seal between the matrix and the replica. The electrolyte seal between the replica and the matrix can be even further improved by forming a spiral rectangular groove at the center portion of the matrix in the area which will be removed during the final finishing of the stampers.

Matrixing apparatus and method for use in the manufacture of molded

It has been found that metal stampers, and more particularly nickel stampers, can be simultaneously hardened and passivated by cathodically treating the stampers in an aqueous bath of a passivation agent.

Method for the manufacture of stampers

A solid electrolyte film-forming capacitor is provided which includes an electroplated conductive layer over the capacitor. The electroplated layer provides greater resistance to mechanical shock and allows the welding of a cathode termination means to the electroplated layer of the capactior. Also provided is a method for electroplating the capacitor which includes placing an electroprocessed capacitor in an electroplating vessel which contains a plating source and electroplating solution, providing a voltage source and connecting the positive terminal of the voltage source to the anode side of the capacitor and to the plating source and the negative terminal of the voltage source to a conducting layer on the anode body, and then electroplating a layer containing metal over the capacitor.

Capacitor including an electroplated layer thereover

A method is provided for electroplating a solid electrolyte film-forming metal capacitor. The method includes placing an electroprocessed capacitor in an electroplating vessel which contains a plating source and electroplating solution, providing a voltage source and connecting the positive terminal of the voltage source to the anode side of the capacitor and to the plating source and the negative terminal of the voltage source to a conducting layer on the anode body, and then electroplating a layer containing metal over the capacitor. Any metal which can be plated may be used, such metals include electrically conductive metals such as silver, gold, copper, nickel, and mixtures thereof. The electroplated layer over the capacitor provides greater resistance to mechanical shock and allows the welding of a cathode termination means to the electroplated layer of the capacitor.

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Indianapolis, IN, United States of America

Charles A Weaver