International Business Machines Corporation

Charles A Joseph

James R Petrozello

James Warren Wilson

Joseph G Ameen

David W Sissenstein, Jr

Dennis L Rivenburgh

Francis J Olshefski

Brenda D Frey

A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.

Chip carrier with protective coating for circuitized surface

An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.

Method of using electrically conductive composition

An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electically conductive bond between a supporting substrate and a semiconductor.

Electrically conductive composition and use thereof

A process for reducing the chloride concentration in a system which contains an ethylenically unsaturated chlorinated hydrocarbon, water and HCl which includes providing certain nitrogen-containing compounds in the system and contacting the system with a molecular sieve. The process surprisingly is capable of regenerating the nitrogen-containing compounds employed.

Growing community of inventors

Candor, NY, United States of America

Charles A Joseph