Intel Corporation

Charavanakumara Gurumurthy

Munehiro Toyama

Kian Sin Sim

Mengzhi Pang

Siew Fong Tai

Tamil Selvy Selvamuniandy

Pilin Liu

Tao Wu

Reynaldo Alberto Olmedo

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

Grid array connection device and method

Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

Solder joints with enhanced electromigration resistance

Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate, masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.

Multiple surface finishes for microelectronic package substrates

Growing community of inventors

Gilbert, AZ, United States of America

Charavanakumara Gurumurthy