University of Sharjah

Chaouki Ghenai

Maamar Bettayeb

Abdul Kadir Hamid

Rafik Kalfat

Essam Mohamed

Oussama Rejeb

Abrar Inayat

Fahad Faraz Ahmad

Haif Aljomard

A method of capturing carbon dioxide comprising synthesising activated carbon using spent coffee grounds (SCG), polyethylene terephthalate (PET), and potassium hydroxide (KOH). The mixture is co-pyrolyzed at a temperature of less than 500 degrees Celsius activated at a temperature of less than 700 degrees Celsius. Carbon dioxide is adsorbed onto a surface of the synthesized activated carbon at a rate of greater than 8 mmol/g at 0 degrees Celsius and at 1 bar absolute pressure. There is also provided an activated carbon product, wherein the activated carbon product has a carbon dioxide adsorption rate of greater than 8 mmol/g at 0 degrees Celsius and at 1 bar absolute pressure.

Carbon dioxide capture using activated carbon derived from spent coffee grounds

The present disclosure provides a cooling system facilitating thermal management in a solar photovoltaic (PV) module. The cooling system includes an exhaust fan, operatively coupled to an outlet of a central air conditioning module, the outlet carries waste air from the central air conditioning module. A supporting structure is placed at a predefined distance in front of the exhaust fan to support one or more solar panels. The one or more solar panels are tilted at a predefined angle and a predefined azimuth configured to provide maximum surface area of the back units of the one or more solar panels. The exhaust fan is further configured to direct the waste air and surrounding air towards the back units of the one or more solar panels at a predefined temperature.

Cooling system for solar photovoltac panels

The invention discloses a thermal management device for high heat flux application in a microelectronic device comprising an integrated board, a microelectronic chip, a thermal interface materials component, a microchannel heat sink assembly operatively connected to the thermal interface materials component, for heat dissipation from the integrated board and the microelectronic chip to the thermal interface materials component, wherein the microchannel heat sink assembly comprises a housing and an adiabatic wall configured to allow heat to pass across the microchannel heat sink assembly. The microchannel heat sink assembly is a four-compartment microchannel heat sink assembly with symmetrical areas.

Thermal management device for high heat flux applications including a microchannel heat sink assembly and method for manufacturing the same

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Sharjah, United Arab Emirates

Chaouki Ghenai