Amazon Technologies, Inc.

Chaoran Yang

Fubin Song

Kun Tang

Cheng Xue

Xin Zhao

Xiaoman Li

Weitian Liu

Ke Guo

Zhifan Gong

Shoubao Wang

Lixin Wu

Jun Ge

Lei Wang

Jianhua Du

Binbin Yang

Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components and batteries. In one embodiment, a device may include a flexible printed circuit, a button cell electrically coupled to the flexible printed circuit, and a system-in-package that is electrically coupled to the flexible printed circuit. The system-in-package may include an electromagnetic interference shield, and a capacitive touch sensor. The capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the electromagnetic interference shield.

Capacitive touch sensing using system-in-package components and batteries

Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.

Systems-in-packages having multiple shielding components

Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.

Capacitive touch sensing using system-in-package components

Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.

System and method for a system-in-package using EMI shielding for capacitive touch sensing

Systems, methods, and computer-readable media are disclosed for camera modules having integrated time of flight sensors. In one embodiment, an integrated sensor module may include a substrate, a molding compound disposed on the substrate, and a camera sensor disposed on the substrate. The integrated sensor module may include a vertical-cavity surface-emitting laser assembly (VCSEL) disposed on the molding compound and separated from the substrate by a first distance, and a single photon avalanche photodiode assembly (SPAD) disposed on the molding compound and separated from the substrate by the first distance. The camera sensor may be configured to detect a first portion of light emitted by the VCSEL and reflected from an object, and the SPAD may be configured to detect a second portion of light emitted by the VCSEL and reflected from the object.

Camera modules having integrated time of flight sensors

Growing community of inventors

Shenzhen, China

Chaoran Yang