Shenzhen Shokz Co., Ltd.

Chaojie Cui

Junjiang Fu

Yueqiang Wang

Lei Zhong

Zhi Cai

Weihua Zhou

Piyou Cheng

Yingying Zhang

The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

Headphones

Growing community of inventors

Shenzhen, China

Chaojie Cui