National Starch and Chemical Investment Holding Corporation

Corn Products Development, Inc.

Brunob II Bv

Chaodong Xiao

Rose Ann Schultz

Quinn K Tong

Donald E Herr

Bodan Ma

Zhixin Li

John Socrates Thomaides

Stanislaw Petrash

Monika Okoniewska

Joseph B Gardner

Yeli Zhang

Christine Puglisi

Wolfgang Bindzus

Christopher Gerald Gore

Sibu Chakrabarti

Peter J Schlom

Yadunandan L Dar

Vincent R Green

Apala Mukherjee

David Shenfield

Yasuo Tokimori

Gregory Krieger

Richard Kuder

Arjnarong Chantranukul

Monika K Okoniewska

This invention relates to a composition comprising physically modified, partially pregelatinized starch, which is useful as a multi-functional excipient for solid dosage forms, a method of making such composition, and solid dosage forms prepared using the composition. Such composition is characterized by a predominance of particles having both birefringent and non-birefringent portions, a sedimentation volume of between 1.5 and 9 ml/g, and a cold water solubility of between 1 and 8%. This free-flowing starch may have an average particle size greater than 30 &#x3bc;m, and a moisture content of between 5 and 12% by weight. The 500 mg placebo tablet prepared from such composition at 13 kN using a manual tablet press equipped with a 1.11 cm ( 7/16&#x2033;) standard concave punches has a crushing strength of at least 160 Newtons, and a disintegration time of no more than 10 minutes.

Tablet excipient

The present invention relates to a method of producing a film forming blend of different acyl gellan gums with starch having similar textural and functional properties compared to gelatin. Films prepared using such blends have a high modulus and excellent strength and elongation. The present invention also relates to soft capsules prepared using such blends or films, which have good sealability.

Blends of different acyl gellan gums and starch

The present invention is directed to a dispersion of polymer particles in a dispersing medium. The polymer particles each contain an average of more than two living radicals that are not chemically protected. The present invention is also directed to a free radical precipitation process involving combining at least one monomer in at least one solvent; dispersing said monomer solvent mixture in a dispersing medium that is non-miscible with the first solvent, using a surfactant, stabilizer or mixture thereof; initiating polymerization with at least one free-radical generating agent and conversion, to produce polymer particles containing radicals trapped by precipitation by virtue of being above the lower critical solution temperature of the system; and removing the precipitating agent either during or after free-radical generation to form a dispersion polymer in the dispersing medium having living, trapped radicals.

Free radical retrograde precipitation polymer dispersions

The present invention is directed to a release composition for molds and formers used in the production of natural and synthetic latex articles. The release coating contains a water-borne, high Tg polymer formed from at least one hydrophobic monomer and at least one hydrophilic monomer, where the Tg of the polymer is at least &minus;10&deg; C. One advantage of the release composition is that it is compatible with a coagulant solution used in the formation of latex gloves. Articles formed using the release coating have good anti-blocking properties.

Mold release and anti-blocking coating for powder-free natural of synthetic rubber articles

The present invention is directed to the use of a polymer coating composition having a dispersant, microbeads and a high Tg polymer with a Tg of greater than &minus;10&deg; C. for the inner coating on natural and synthetic rubber articles, particularly for latex gloves. The coating for rubber articles, provides an inner surface coating that reduces friction between the latex and the hand to allow convenient donning. They are deliverable from aqueous solution.

Polymer coating for rubber articles

Allylated amide compounds are formulated into curable compositions with a free radical curing agent, and optionally, one or more fillers, for use as adhesives in the manufacture of microelectronic devices.

Allylated amide compounds and die attach adhesives prepared therefrom

Underfill encapsulants are prepared from allylated amide compounds and a curing initiator.

Underfill encapsulants prepared from allylated amide compounds

This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.

A curable composition for use in the fabrication and assembly of circuit components and printed wire boards, which may be designed to be reworkable, comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free-radical initiator or a photoinitiator, and optionally, one or more fillers. The circuit component is formed by applying the curable composition to the printed wire board and curing the composition in situ on the board.

Compositions for use in the fabrication of circuit components and printed wire boards

A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.

Method of making an electronic component using reworkable underfill encapsulants

This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.

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East Hanover, NJ, United States of America

Chaodong Xiao