Beijing Dajia Internet Information Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Beijing Baidu Netcom Science and Technology Co., Ltd.

Peking University

Chinese Academy of Sciences

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Beijing Zitiao Network Technology Co., Ltd.

Beijing Founder Electronics Co., Ltd.

Other

Hefei Boe Optoelectronics Technology Co., Ltd.

Qingdao University of Technology

Boe Technology Group

Uc Mobile Limited

Chao Zhou

Liqiang Chen

Jiafan Shi

Zuojia Wang

Qingsong Wang

Yongchun Jiang

Qian Yin

Guang Ling

Ziqi Song

Changbo Liu

Tuo Sun

Shuo Zhang

Yanzhao Li

Shuo Huang

Zongming Guo

Shiwei Huang

Yin Zhang

Yunpeng Zhang

Guyue Zhou

Xinggong Zhang

Yingzhan Lin

Youpeng Gan

Xingjian Xu

Wenmin Wang

Xin Lai

Jiaxin Lin

Xianchun Huang

Yichuan Liang

Zeying Xie

Bing Yu

Tao N Zhang

Peng Li

Jie Liang

Lei Shi

Yan Zhang

Wei Xu

Zhenzhong Zhang

Kui Liang

Jingzhou He

Lei Feng

Min Tan

Rui Chen

Liang Guo

Yaming Wang

Shunyan Zhu

Di Jiang

Yongfu Yu

Cuifang Zhang

Xiaopeng He

Zhihong Fu

Dongdong Zhao

Jie Wen

Yu Ji

Yulan Hu

Yingli Shi

Wei Wen

Jiong Huang

Jinbo Zhan

Xinfu Liu

Sifan Wang

Lele Han

Guojun Zhang

Zhiqiang Cao

Wei Bi

Chunhua Liu

Wencheng Hu

Guoping Qian

Peng Gao

Honggui Qu

Yuhui Cao

Shucheng Zhong

Yu Wu

Dachun Liao

Zhehao Li

Zhengyun Wu

Zhisheng Wang

Xilong Liu

Luning Wang

Xiaoqian Liu

Zhaohui Yan

Wanqing Chen

Jian He

Haijun Zhang

Lingling Zeng

Yuxia Yin

Longfei Li

Shoutao Lu

Yanwei Zhao

Jinggang Qin

Shousen Zhang

Jianjun Wu

Kun Ai

Zhihui Liu

Yingbin Su

Tixi He

Tao Geng

Guangfu Zhou

Yousheng Ji

Xiaochuan Liu

The present disclosure provides a method for forming a via hole in a flexible substrate, including: providing a base substrate and forming a de-bonding layer on the base substrate; forming a seed metal layer on the de-bonding layer, and patterning the seed metal layer to form a first conductive pattern; forming a first flexible substrate on the seed metal layer; forming a first mask layer on the first flexible substrate; and forming a first via hole in the flexible substrate though a dry etching process, the first via hole penetrating the first flexible substrate to expose a connection region of the first conductive pattern. The present disclosure further provides a method for filling a via hole in a flexible substrate.

Methods for forming via hole and filling via hole in flexible substrate

A flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region arranged at a side of the display region opposite to a light-exiting side, and a bending region between the display region and the bonding region. The flexible display module further includes a flexible substrate supporting the flexible display panel, the flexible substrate includes a first flexible substrate and a second flexible substrate. The circuit board is connected to the other end of the second flexible substrate at a first position. An orthographic projection of the driving chip onto a plane where the first flexible substrate is located and an orthographic projection of the bending region onto the plane where the first flexible substrate is located are both located on a same side of a first vertical line.

Flexible display module and manufacturing method thereof

A display panel includes an array substrate, a composite functional layer, a first adhesive layer and a cover plate. The composite functional layer is located on a side of the light-emitting layer away from the base substrate. A through hole penetrating through the composite functional layer and the array substrate is formed on the array substrate and the composite functional layer. The array substrate includes a non-display area surrounding the through hole. The composite functional layer includes a first shading layer, and the orthographic projection of the first shading layer on the array substrate is located in the non-display area of the array substrate. The first adhesive layer is located on a side of the composite functional layer away from the base substrate. The cover plate is located on a side of the first adhesive layer away from the base substrate.

Display panel and manufacturing method therefor, and display device

A MEMS switch, a preparation method thereof, and an electronic apparatus. The MEMS switch includes: a substrate, a coplanar waveguide line structure disposed on a side of the substrate, an isolation structure disposed on a side of the coplanar waveguide line structure away from the substrate, a film bridge disposed on a side of the isolation structure away from the substrate. The coplanar waveguide line structure includes a first wire, a first DC bias line, a second wire, a second DC bias line and a third wire arranged at intervals sequentially. The second wire is one of an RF signal transmission line and a ground line, the first wire and the third wire are the other of the RF signal transmission line and the ground line. The film bridge is crossed between the first wire and third wire, and is connected with the first wire and the third wire respectively.

MEMS switch, preparation method thereof, and electronic apparatus

The present disclosure provides a graphics rendering method and apparatus, and a storage medium. In the method, a to-be-rendered graphic is determined, then an offset value and a size of a vertex filleted corner of a corresponding to-be-processed mask are determined based on a progress value of the to-be-rendered graphic, where the to-be-rendered graphic includes one or more vertex filleted corners, so that graphics rendering is performed on a UI based on the offset value and the size of the vertex filleted corner of the to-be-processed mask, thereby realizing the rendering of a graphic including a vertex filleted corner. Moreover, a vertex filleted corner at which the to-be-processed mask intersects with the to-be-rendered graphic is considered when the graphics rendering is performed according to embodiments of the present disclosure.

Graphics rendering method and apparatus, and storage medium

A linewidth measurement method includes: obtaining a target image of the line, the line including a first line segment; performing region connecting on an edge image or binary image of the target image to obtain a region connected image, the region connected image including a target connected region corresponding to a pattern of the line, and a pixel value of each pixel in the target connected region being different from that of each pixel outside the target connected region; determining a first edge point and a second edge point of the first line segment based on the region connected image; and determining a width of the first line segment according to the first edge point and the second edge point, and determining the width of the line according to the width of the first line segment.

Linewidth measurement method and apparatus, computing and processing device, computer program and computer readable medium

The present invention provides a multi-degree-of-freedom conductor depositing system for tokamak toroidal field coil winding packs, belongs to the field of development of toroidal field superconducting coils for nuclear fusion. The multi-degree-of-freedom conductor depositing system is mounted on a winding table and distributed along the contour of the toroidal field coil. The optical proximity switches detect the position signals between the winding table and the bending unit and transmit them to an automatic control system. The multi-degree-of-freedom conductor depositing system is distributed in a spiral shape from the top to the bottom from the position of the bending unit along the direction of coil winding. The conductor is deposited onto the track drive mechanism of the multi-degree-of-freedom conductor depositing device, which has a bidirectional moving and rotating function. This avoids the risk of insulation rupture due to friction between the conductor and the depositing tooling during the coil winding process. It also has the advantages of simple structure, convenient operation and high reliability.

Multi-degree-of-freedom conductor automatic depositing system for tokamak toroidal field coil winding packs

The present disclosure provides an interaction method and apparatus, and a storage medium. The method includes: an execution component receives a trigger request sent by an input device, where the execution component corresponds to the input device. A state of the execution component is active, and states of other execution components are inactive. Thus, only one input device is active (can trigger an event) at the same time, so that an UI only responds to one trigger at the same time. And then, according to the trigger request, trigger signal collision detection and event processing are performed, and a processed result is displayed on the UI. It solves the problem that how the UI responds correctly for the interaction between multiple input devices and the UI in a XR scenario, and ensures the UI interaction in the XR scenario is correct, fast and complete.

Interaction method and apparatus, and storage medium

An array substrate, a display panel and methods of manufacturing the same are provided. The method of manufacturing an array substrate according to an embodiment of the present disclosure includes: forming f pixel electrodes and a conductive structure on a substrate through a patterning process, wherein the pixel electrodes arranged in a first direction are connected through the conductive structure; and forming a signal line on the substrate through a patterning process, wherein the signal line and the pixel electrodes are disposed in the same layer. By means of the array substrate according to the embodiments of the present disclosure, the problem that it is not easy to discover the point defects caused by short circuit between the signal line and pixel electrodes in the related art can be solved.

Array substrate, display panel and manufacturing method thereof

Embodiments of the present application provide an array substrate and manufacturing method thereof, and a display panel, display device, display kit. The array substrate includes: a base substrate, and a reflective layer on a side of the base substrate; the reflective layer includes: a plurality of micro-capsules; each of the micro-capsules includes: a plurality of absorbing particles and a plurality of reflecting particles; the absorbing particles are magnetic particles absorbing light; the reflecting particles are non-magnetic particles reflecting light.

Array substrate and manufacturing method thereof, display panel, display device, display kit

Disclosed is a degradable zinc base alloy implant material comprising, by mass percentage content, 0.01 wt % to 14 wt % of Fe, 0 wt % to 13 wt % of functional elements and the remainder being Zn and a preparation method and use thereof. During preparation, Zn, Fe, and the functional elements are homogeneously mixed and placed into a high-purity graphite crucible and smelted together under a mixed gas atmosphere of SFand CO. The mechanical properties of the zinc base alloy implant material have been significantly improved, so that the implant material is easy to process and shape, and so that the properties of strength and plasticity, etc., meet the basic requirements of human body implant materials, such as vascular stents, orthopedic internal fixation systems, and the like.

Degradable zinc base alloy implant material and preparation method and use thereof

A profiling device, a profiling method, a bonding system, a bonding method, and a display device are provided. The profiling device includes a profiling jig. The profiling jig includes an attaching surface. The attaching surface is switchable between a planar state and a profiling state, and the attaching surface is a planar surface in the case that the attaching surface is in the planar state, and the attaching surface is a profiling surface in the case that the attaching surface is in the profiling state.

Profiling device, profiling method, bonding system, bonding method, and display device

The present disclosure provides a flexible display module and a method for manufacturing the flexible display module. The flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region, and the driving chip and the circuit board are arranged at the bonding region. The circuit board includes a first flexible printed circuit and a first printed circuit board provided with an electronic element, the first printed circuit board is coupled to one end of the first flexible printed circuit, and the first flexible printed circuit includes a bonded portion coupled to the bonding region of the flexible display panel. The first flexible printed circuit is bent so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel.

Growing community of inventors

Beijing, China

Chao Zhou