Altek Biotechnology Corporation

Altek Corporation

Chao-Yu Chou

Parn-Far Chen

Hsi-Hsin Loo

Hsiu-Wu Tung

Po-Ju Chen

Liang-Yi Li

Te-Yu Chung

Chun-Wei Liu

Ting Cheng Ke

Ting-Cheng Ke

Fang-Mentg Kuo

An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.

Image capturing module, endoscope and method of manufacturing image capturing module

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

Endoscope device and cable assembly thereof

An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.

Electronic device and electronic system

A microelectronic device includes an accommodating housing, a circuit board, an electronic component, and a conducting wire. The accommodating housing has an accommodating space therein. The circuit board is disposed within the accommodating space, and has a first and a second end surface disposed opposite to each other. The first end surface includes a first conductive contact, and a lateral side of the circuit board includes a receiving hole being a half-open hole extending from the second end surface. A second conductive contact is disposed on the surface of the receiving hole and electrically connected to the first conductive contact via an internal power layer of the circuit board. The electronic component is disposed on the first end surface and electrically connected to the first conductive contact. One end of the conducting wire is disposed in the receiving hole and electrically connected to the second conductive contact.

Microelectronic device and circuit board thereof

A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Wire soldered structure

The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate has a main connector electrically connected to the second wire group. A plurality of first signal transmission lines connected to the first wire group. The second circuit substrate has a sub-connector that is electrically connected to sub printed wires having an equivalent number as and corresponding to the second wire group. The other end of the sub printed wires is electrically connected to a plurality of second signal transmission lines. Through connecting the connectors respectively disposed in different circuit boards to overcome the difficulty in the manufacturing process of concentrating all devices on a single circuit board.

Micro-sensor and manufacturing method thereof

The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.

Growing community of inventors

Hsinchu, Taiwan

Chao-Yu Chou