Lingsen Precision Industries, Ltd.

Ehoma Industrial Corporation

Unisense Technology Co., Ltd

Chao-Wei Yu

Ming-Te Tu

Chun-Huan Chuang

Yu-Lin Hsiao

Chih-Ming Liu

Yu-Shiang Chen

Su-Wei Huang

A vibration-isolating device based on magnetic damping includes a housing and an internal seat. The housing receives a first magnetic member and has a first buffer. The internal seat has a base portion received in the housing and has a raised portion protruding from the housing. The base portion has a second magnetic member positionally opposite to the first magnetic member to generate a damping effect. A second buffer is between the base portion and the housing and aligned with the first buffer. When an object is fixed to the raised portion, the object and the housing jointly hold the first buffer and leave a gap therebetween. The housing and the base portion hold the second buffer therebetween. When the object receives vibration, the first buffer and the second buffer damp the vibration first and the internal seat uses the damping effect to counteract any remaining part of the vibration.

Vibration-isolating device based on magnetic damping

A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.

Substrate and package module including the same

A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.

Pressure sensor package

An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.

Growing community of inventors

Taichung, Taiwan

Chao-Wei Yu