Merry Electronics (shenzhen) Co., Ltd.

Merry Electronics Co., Ltd.

Chao-Sen Chang

Jen-Yi Chen

Kai-Yu Jiang

Chun-Chieh Wang

Yueh-Kang Lee

Yong-Shiang Chang

Yung-Hsiang Chang

Hung-Chi Lin

Yung-Shiang Chang

Yen Ta Chiang

Jui-Chin Peng

A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.

Micro-electro mechanical device with vibration sensor and micro-electro mechanical microphone

A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.

Vibration sensor with pressure enhancement

A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.

Microphone module

A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. An air gap is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. An adhesive layer is formed between a spacer and a circuit board, and the air gap is formed in an adhesive-absent section between the spacer and the circuit board. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.

Vibration sensor having vent for pressure enhancing member

A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.

Vibration sensing assembly for bone conduction microphone

A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. A first through hole is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.

Vibration sensor for obtaining signals with high signal-to-noise ratio

The invention provides an earphone and a set of earphones. The earphone includes a processing circuit and a filtering module. The processing circuit acquires a first speech signal and performs a pre-processing operation on the first speech signal to generate a second speech signal. The filtering module includes high-pass, low-pass, and band-pass filters. The processing circuit is further configured to: receive first, second, and third signals respectively from the high-pass, low-pass, and band-pass filters; perform a noise reduction operation on the second and third signals to generate a fourth signal; and perform a signal synthesis operation on the first and fourth signals to synthesize the first and fourth signals to form an output speech signal.

Earphone and set of earphones

A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.

Speaker

A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.

Microphone package structure

A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.

MEMS sensor

A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

MEMS speaker

A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.

Piezoelectric transducer

A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

MEMS chip package

An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.

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Taichung, Taiwan

Chao-Sen Chang