Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Tencent Technology (shenzhen) Company Limited

Other

Shenzhen Efercro Electronic Technology Co., Ltd

Huawei Technologies Co., Limited

Bgi Shenzhen

Bgi-shenzhen Co., Limited

Bgi Agricultural and Circular Economic Tech Co., Ltd.

Chao Peng

Jie Liu

Xian-Qin Hu

Hong Liu

Yuanjiang Peng

Xingping Long

Ying-Qiu Zheng

Bo Xu

Guoming Chen

Ke He

Wenjun Ou

Zhanlei Yang

Chih-hung Chen

Wenjie Li

Yinan Zhen

Longshuai Xiao

Case for tablet computer

A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer, wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.

Circuit board and manufacturing method therefor

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Circuit board and method for manufacturing the same

The present disclosure provides a method for sharing photos or videos with a digital photo frame, the method comprising receiving, by a server, an operation command for connecting at least one terminal to the digital photo frame; generating and transmitting, by the server, a code to the digital photo frame in response to the received operation command; determining, by the server, whether a code entered by the at least one terminal is matched with the generated code; connecting, by the server, the at least one terminal to the digital photo frame when determining that the code entered by the at least one terminal is matched with the generated code; and instructing, by the server, the digital photo frame to receive the photos or the videos from the at least one connected terminal.

Digital photo frame, a system thereof, and a method thereof

Provided is a method for detecting an audio input interface, comprising: acquiring input signals of every one of audio input interfaces; acquiring energy values of said input signals of every one of said audio input interfaces, and acquiring an interface identification of the audio input interface of which the energy value is the maximum among the energy values; adding said interface identification acquired herein into an identification sequence in an order by acquiring time; and identifying the audio input interface, of which the interface identification is saved most often in said identification sequence, as a valid audio input interface. Also provided is a system for detecting an audio input interface. The present disclosure is capable of effectively identifying the audio input interface connected to the microphone that the user is using, so that the user does not need to switch manually.

Method, system and computer storage medium for detecting an audio input interface

Systems and methods are provided for audio encoding. For example, first quantization encoding is performed on audio data associated with a current frame of an audio data stream to obtain first quantization-encoded data; second quantization encoding is performed on the audio data to obtain second quantization-encoded data; the first quantization-encoded data is coupled to the current frame of the audio data stream; and the second quantization-encoded data is coupled to a next frame of the audio data stream.

Systems and methods for audio encoding and decoding

Growing community of inventors

Shenzhen, China

Chao Peng