Guangzhou Luxvisions Innovation Technology Limited

China Electronics Reliability and Environmental Testing Institute

Chao Pang

Liang He

LingYun Mi

Yinle Li

Lingyun Mi

Chaoyuan Chan

Yiqiang Ni

Bin Qin

Shizheng Yang

A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.

Method and apparatus for fault isolation, computer device, medium and program product

Provided are a photosensitive assembly, a camera module, and an electronic device. The electronic device includes an electronic device body and a camera module mounted on the electronic device body. The camera module includes a lens and a photosensitive assembly. The photosensitive assembly includes a circuit board, a photosensitive element, a base, and an adhesive. The circuit board is provided with an accommodation cavity that extends through the circuit board. The photosensitive element is accommodated in the accommodation cavity and electrically connected to the circuit board. The base is disposed on the circuit board. The lens is located in the photosensitive path of the photosensitive element. The adhesive includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located in the accommodation cavity. The second adhesive portion is located outside the accommodation cavity.

Photosensitive assembly, camera module and electronic device

A display module and manufacturing method thereof. The display module comprises a display screen, a first absorption polarizer, a first quarter wave plate, an optical lens component, and a convex lens component in sequence from a display side to a viewing side. The optical lens component and the convex lens component are optically coaxial. The convex lens component comprises a convex lens, a second absorption polarizer, and an optical integrated element, which are laminated in sequence from the viewing side to the display side. The optical integrated element comprises a second quarter wave plate and, on one side surface of the optical integrated element, a coated reflective polarizing film or a nano-imprinted metal grating. The reflective polarizing film or the metal grating is attached to the second absorption polarizer.

Display module and manufacturing method thereof

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Guangzhou, China

Chao Pang