Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Foxcomm Technology Co., Ltd.

Chao-Nien Tung

Chuen-Shu Hou

Tay-Jian Liu

Chih-Hsien Sun

Chih-Hao Yang

Cheng-Chi Lee

Chih-Peng Lee

Cheng-Hui Lin

Lung-Wei Huang

Xiao-Long Li

Qian-Hua He

Hui-Fu Lee

Keng-Han Liu

Ming Zhong

Xi-Jian Zhu

Chih-Feng Fan

Shun-I Wu

Kuo-Chu Hsieh

Jing-Hao Li

A heat pipe includes a shell containing a working fluid therein, a capillary wick arranged within the shell and a vapor channel. The shell includes an evaporating section, a condensing section and an adiabatic section located between the evaporating section and the condensing section. The capillary wick includes a first segment occupying the whole of the evaporating section, a second segment and a third segment received in the condensing section and connected to the first segment by the second segment. The vapor channel is defined between the second segment of the capillary wick and the shell.

Heat pipe

A heat pipe includes a cylinder-shaped casing () containing a working fluid therein and a capillary wick () arranged on an inner wall of the casing. The capillary wick encloses a vapor passage () in a center of the casing. The capillary wick includes a plurality of shaped foils stacked on the inner wall of the casing along a radial direction thereof. The foils are sintered to the inner wall of the casing and define a multi-channel structure for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.

Heat pipe with capillary wick

A heat pipe includes a metal casing () filled with a working fluid therein, a capillary wick () provided inside of the metal casing and a tube () contacting with a surface of the capillary wick. The metal casing includes an evaporating section (), a condensing section () and an adiabatic section () between the evaporating section and the condensing section. A vapor passage () is formed inside of the casing and a liquid channel () is defined by the capillary wick. The working fluid in vapor state flows from the evaporating section towards the condensing section along the vapor passage and the working fluid in liquid state returns to the evaporating section from the condensing section along the liquid channel. The tube separates the vapor from the liquid at a place where the tube is located.

Heat pipe with multiple wicks

A method () and an apparatus for manufacturing a heat-dissipation device () with a vacuum chamber and a working fluid therein are disclosed. The method includes the following steps: vacuuming a hollow metal casing () through a first open end () thereof until an interior of the casing reaches a predetermined vacuum degree; sealing the first open end; filling a predetermined quantity of working fluid into the casing through a second open end () thereof; and sealing the second open end. The apparatus includes a vacuum pump, a liquid-storage tank and a set of processing device, as used respectively for the above vacuuming, liquid-filling and sealing steps. By this apparatus, the heat-dissipation device can be manufactured at a same place without the requirement to shift the casing from one place to another place during the manufacture of the heat-dissipation device.

Method for making heat-dissipation device having vacuum chamber and working fluid therein

A loop-type heat exchange device () includes an evaporator (), a vapor conduit (), a condenser () and a liquid conduit (). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (), a plurality of tube members () being in fluid communication with the housing member, and a fin member () maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.

Loop-type heat exchange device

A cooling system for removing heat from a heat generating component, includes a base () and a heat sink () mounted on the base. The base includes a bottom wall () and a side wall () surrounding the bottom wall. The bottom wall and the side wall cooperatively define a space () receiving working fluid therein. The heat sink defines an evaporating passage () and a condensing passage () therein. The two passages are in fluid communication with the space. Cooperatively the space and the passages define a loop for circulating the working fluid therein. The working fluid has a phase change for dissipating heat generated by a heat-generating electronic component.

Integrated cooling system for electronic components

A heat exchange module () includes a fan duct, an evaporator (), a condenser () and an electric fan (). The fan duct includes a lower portion () and an upper portion (). The lower portion cooperates with the upper portion to define therebetween an air passage (). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component () and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.

Heat exchange module

A heat pipe and a method for producing the heat pipe are disclosed. The heat pipe includes a hollow metal casing and a honeycombed wick structure arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices stacked together. Each of the slices defines a plurality of pores therein to form a plurality of micro-channels in the wick structure, whereby porosity of the wick structure can be accurately controlled.

Heat pipe and method for producing the same

A heat pipe includes a hollow metal casing () and a honeycombed wick structure () arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices () stacked together. Each of the slices has a plurality of pores therein and a plurality of protrusions () formed thereon along a longitudinal direction of the heat pipe to form a plurality of liquid channels () in the wick structure along the longitudinal direction of the heat pipe. Each liquid channel has alternate large and small sections () along a length thereof.

A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Performance testing apparatus for heat pipes

A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

A heat exchange module () is disclosed, which includes an evaporator (), a condenser () and a heat sink (). The evaporator defines therein a chamber for containing a wick structure () saturated with a working fluid. The wick structure occupies a portion of the chamber. The condenser is disposed adjacent to the evaporator, wherein the working fluid turns into vapor in the evaporator after absorbing heat of a heat-generating component and the vapor turns into condensate at the condenser after releasing the heat. The heat sink is attached to an outer surface of the evaporator and located in alignment with the wick structure contained in the evaporator.

Heat exchange module for electronic components

A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.

A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.

A group of powders () for making a wick structure of a heat pipe includes main powders () and supplemental powders (). The melting point of the supplemental powder is lower than that of the main powder. During a sintering process, the powders are filled in a casing of the heat pipe and have a eutectic reaction between the main powders and the supplemental powders to form the wick structure. The temperature for the eutectic reaction is lower than the melting temperature of the supplemental powders.

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Tu-Cheng, Taiwan

Chao-Nien Tung