Delta Electronics, Inc.

Chao-Liang Tseng

Chi Hsu

Ke-Cheng Lin

Chi-An Chang

In a radio frequency (RF) amplifier system and a heat dissipation device thereof, the RF amplifier system includes an RF amplifier and a heat dissipation device. The RF amplifier includes an RF power element. The heat dissipation device includes a heat conduction board, a plurality of heat pipes and fins. The heat conduction board is thermally conductively coupled to the RF power element, and one end of the heat pipe is thermally conductively coupled to the heat conduction board. The fins are arranged in parallel and spaced from each other. The other end of each of the heat pipes is inserted through the fins. The heat of the RF power element is conducted to the heat conduction board and the heat pipe, and then the heat is quickly conducted to the fins to be dissipated away quickly, and the RF power element can quickly reach a stable temperature.

Growing community of inventors

Taoyuan, Taiwan

Chao-Liang Tseng