Quanta Computer Incorporated

National Yang Ming Chiao Tung University

Avermedia Technologies, Inc.

E Ink Holdings Inc.

Avermedia Tehnologies, Inc.

Quantra Computer Inc.

Chao-Jung Chen

Yu-Nien Huang

Yaw-Tzorng Tsorng

Chih-Ming Chen

Hou-Hsien Chang

Maw-Zan Jau

Kun-Pei Liu

Chih-Hsiang Lee

Herman Tan

Chun Feng Chang

Chih-Wei Lin

Ching-Yu Chen

Tsung-Ta Li

Kuo-Wei Lee

Yi-Chieh Chen

Chi-Fu Chen

Ta-Chih Chen

Chen Tseng

Jen-Mao Chen

Po-Chen Liu

Ming-Lun Ku

Chen-Chien Kuo

Tien-Juei Chuang

Bing-Fei Wu

Wei-Pin Chen

Wei-Cheng Tseng

Kuen-Hsien Wu

Yueh-Chang Wu

Yuan-Chen Liang

Tzu-Hung Wang

Wei-Yi Chu

Jyue Hou

Sin-Hong Lien

Wen-Liang Huang

Chung-Hua Jen

Huan-Shu Chien

Ming-Sheng Chang

Cheng-Chieh Weng

Chih-Chung Kao

Chia-Wei Huang

Yi-Te Chang

I-Lang Cheng

Mao-Chao Yang

Chang-Yu Chiang

Kai-Hung Lin

Jen-Hui Wang

Yung-Hsiang Lu

Meng-Liang Chung

Wei-Chun Chang

Yao-Long Lin

Wei-Chih Hung

Yu-Syuan Lin

Zhi-Hao Tseng

Chung-Kai Chen

Chung-Cheng Chiu

Min-Yu Ku

Wei-Chih Yang

Tsung-Cheng Lin

Yu Nien Huang

Guo-Xiang Hu

Te-Hao Hu

Tsung-Chun Fu

I-Hsuan Chiang

Yung-Shiang Lin

Sheng-Wei Tang

Chih-Chun Liu

Cheng-Yen Yang

Ying-Han Chen

Hsiang-Wei Liu

Wen-Lung Liao

Kai-Cheng Chuang

Le-Sheng Chou

Chin-Chu Chen

Hsiao-Tsu Ni

Chih-Kai Chang

Jen-Hsiang Lee

Chien-Wei Huang

Shih-Wei Chao

Chien-Pang Chen

Ching-Yi Shih

Tien-Jung Chang

Ming-Hung Tsai

Guo-Ming Huang

Yen-Lin Chen

Chien-Chung Chiang

Jui-Tang Chang

Cheng-Wang Lin

Chun-Yi Lien

Chien-Lung Tseng

Cheng-Hsiang Huang

Ming-Yuan Hung

Ta-Chun Lin

Yu-Shin Liao

Jhih-Bin Guan

Shao-Yu Chen

Yung-Lung Liu

Wen-Hsin Lin

Hsueh-Chin Lu

Rong-Teng Sie

A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.

Arrayed cold plate for DIMMs

A multi-node computing system is disclosed. The multi-node computing system includes a chassis and a detachable cable cage removably mounted within the chassis. The detachable cable cage includes a base frame assembly having a bottom plate connecting a first plate and a second plate. The first and second plate face each other and extend across a width of the base frame assembly between a first side and a second side of the base frame assembly. The detachable cable cage further includes a first panel assembly movingly coupled to the first side of the base frame assembly and a second panel assembly movingly coupled to the second side of the base frame assembly. The first panel assembly and/or the second panel assembly is movable between a closed position and an open position, and an internal space of the detachable cable cage is accessible in the open position.

Detachable cable cage for multi-node computing system

A rotatable joint for use in a liquid cooling system comprises a main body and at least one housing portion. The main body has a main body passageway defined therethrough. The at least one housing portion is rotatably coupled to the main body and has a housing portion passageway defined therethrough that is fluidly coupled to the main body passageway. The main body is rotatable between a first position and a second position relative to the at least one housing portion. The main body passageway is fluidly coupled to the housing portion passageway when the main body is in either of the first position and the second position.

Liquid cooling system with rotatable joint

An air-shielding mechanism for a computing system is disclosed. A computing system includes a server chassis with a slot configured to receive a computing node. An air-shielding mechanism is positioned within the slot and includes a connecting rod movably coupled within the slot and a movable flap coupled to the connecting rod. The connecting rod rotates in a first direction in response to pressure generated by contact between the computing node inserted within the slot and the connecting rod. The movable flap is in a closed position when the computing node is absent from the slot, and the movable flap is in an open position when the computing node is fully inserted within the respective slot. The movable flap rotates in a second direction while the connecting rod is rotating in the first direction, the second direction being opposite the first direction.

Air shielding mechanism for computing system

An information technology (IT) system is directed to immersion cooling and includes a chassis forming an enclosure between an upstream side and a downstream side. The chassis has a rear opening formed along the downstream side and is configured to receive heat-generating components of the IT system adjacent to the upstream side within the enclosure. The system further includes a supply conduit for delivering an immersion coolant to the upstream side within the enclosure, and a flap mechanism attached to the downstream side near the rear opening. The flap mechanism is movable between an open position and a closed position, which allows accumulated coolant to drain from the chassis in the open position and prevents the accumulated coolant from draining from the chassis in the closed position.

Immersion cooling rack with drain control

A connector assembly that may be used to connect an upper circuit board to a lower circuit board is disclosed. The connector assembly includes a base, and a bracket mechanically fastened to the base. The connector assembly also has a handle rotatably coupled to the base. The connector assembly includes a link bar movably coupling the handle to the base. The connector assembly further includes a guiding feature mechanically coupled between the base and the bracket. The guiding feature is configured to direct relative motion between the base and the bracket. The link bar and the guiding feature are also configured to transfer an external force applied to the handle, the external force being transferred to the upper and lower circuit boards via the base and the bracket.

Force saving mechanism for circuit board installation

A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

Multi-stage liquid cooling system

A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.

System and method for hybrid direct-to-chip liquid and immersion cooling

A computing system includes a chassis, a water circulation network coupled to the chassis, a power distribution network coupled to the chassis, and one or more sleds removably coupled to the chassis. The water circulation network includes a cold water distribution network and a hot water collection network. Each sled of the one or more sleds includes a corresponding cold plate. Each sled is configured to slide along the chassis in two slide directions including a slide-close direction to reach a closed position and a slide-open direction to vacate the closed position. When in the closed position, each sled is configured to (a) bridge the hot water collection network and the cold water distribution network via the corresponding cold plate and (b) couple to the power distribution network.

Modular liquid cooling for multi-node computing systems

A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

Nucleation surface treatment for thermal cooling

A liquid cooling rack assembly for a computing system includes a first cabinet rack configured to receive within a plurality of computing devices with heat-generating electronic components; and a second cabinet rack configured to receive coolant components. The second cabinet rack has a plurality of movable trays, each tray of the plurality of movable trays being movable generally horizontally and independently of other trays of the plurality of movable trays. The liquid cooling rack assembly further includes a plurality of cooling pumps. Each pump of the plurality of cooling pumps is placed on a respective one of the plurality of movable trays, and each pump is independently serviceable from other pumps of the plurality of cooling pumps based on independent movement of a respective tray.

Liquid cooling rack assembly for computing system and telecommunication system including the same

A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.

System and method for cooling electronic computing device with multiple-function pump

A partition device for improving cooling of a heat-generating electronic device includes a grid panel and an airflow deflector. The grid panel has one or more apertures and a thickness that extends from a leading surface to a trailing surface. The apertures of the grid panel extend parallel to an airflow direction of forced air flowing across the thickness of the grid panel and through the apertures. The airflow deflector is attached at least in part within one of the apertures, and the airflow deflector has an airfoil shape for reducing air resistance between the forced air and the grid panel. The airfoil shape has a leading edge that redirects initial contact with the forced air and a trailing edge that continues redirecting the forced air.

Partition device with airfoil-shaped airflow deflectors

A single-phase immersion cooling system includes an immersion cooling tank having a component area, which is separate from a main chamber and is configured to receive a heat-generating electronic device. A coolant circulates along a flow path, in a chamber path through the main chamber and a component path through the component area. A rotating propeller is mounted within the immersion cooling tank, causing a driven flow path in the component area. The driven flow path is configured to cause contact between the coolant in the driven flow path and the heat-generating electronic device when the heat-generating electronic device is received within the component area. The coolant in the driven flow path circulates at a faster speed than the coolant in the chamber path.

Force convection driven by propeller applied in single-phase immersion cooling

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Systems and methods for cooling a fluid circuit for cooling a rack of servers

Growing community of inventors

Taoyuan, Taiwan

Chao-Jung Chen