Quanta Computer Incorporated

National Yang Ming Chiao Tung University

Avermedia Technologies, Inc.

E Ink Holdings Inc.

Avermedia Tehnologies, Inc.

Quantra Computer Inc.

Chao-Jung Chen

Yu-Nien Huang

Yaw-Tzorng Tsorng

Chih-Ming Chen

Hou-Hsien Chang

Maw-Zan Jau

Kun-Pei Liu

Chun Feng Chang

Chih-Hsiang Lee

Herman Tan

Chih-Wei Lin

Ching-Yu Chen

Kuo-Wei Lee

Tsung-Ta Li

Yi-Chieh Chen

Chi-Fu Chen

Ta-Chih Chen

Chen Tseng

Jen-Mao Chen

Po-Chen Liu

Ming-Lun Ku

Chen-Chien Kuo

Tien-Juei Chuang

Bing-Fei Wu

Wei-Pin Chen

Wei-Cheng Tseng

Kuen-Hsien Wu

Yueh-Chang Wu

Yuan-Chen Liang

Tzu-Hung Wang

Wei-Yi Chu

Jyue Hou

Sin-Hong Lien

Wen-Liang Huang

Chung-Hua Jen

Ming-Sheng Chang

Cheng-Chieh Weng

Chih-Chung Kao

Chia-Wei Huang

Yi-Te Chang

I-Lang Cheng

Chang-Yu Chiang

Mao-Chao Yang

Kai-Hung Lin

Jen-Hui Wang

Yung-Hsiang Lu

Meng-Liang Chung

Wei-Chun Chang

Wei-Chih Hung

Yu-Syuan Lin

Zhi-Hao Tseng

Chung-Kai Chen

Chung-Cheng Chiu

Min-Yu Ku

Tsung-Cheng Lin

Huan-Shu Chien

Yu Nien Huang

Te-Hao Hu

Tsung-Chun Fu

I-Hsuan Chiang

Yung-Shiang Lin

Chih-Chun Liu

Sheng-Wei Tang

Cheng-Yen Yang

Ying-Han Chen

Guo-Xiang Hu

Hsiang-Wei Liu

Che-Hung Lin

Wen-Lung Liao

Wei-Chih Yang

Kai-Cheng Chuang

Le-Sheng Chou

Hsiao-Tsu Ni

Chih-Kai Chang

Jen-Hsiang Lee

Chien-Wei Huang

Yao-Long Lin

Shih-Wei Chao

Chien-Pang Chen

Ching-Yi Shih

Tien-Jung Chang

Ming-Hung Tsai

Guo-Ming Huang

Yen-Lin Chen

Cheng-Wang Lin

Chun-Yi Lien

Chien-Chung Chiang

Chien-Lung Tseng

Ta-Chun Lin

Cheng-Hsiang Huang

Yu-Shin Liao

Jui-Tang Chang

Shao-Yu Chen

Wen-Hsin Lin

Hsueh-Chin Lu

Yung-Lung Liu

Rong-Teng Sie

Wen-Tse Yan

A connector assembly that may be used to connect an upper circuit board to a lower circuit board is disclosed. The connector assembly includes a base, and a bracket mechanically fastened to the base. The connector assembly also has a handle rotatably coupled to the base. The connector assembly includes a link bar movably coupling the handle to the base. The connector assembly further includes a guiding feature mechanically coupled between the base and the bracket. The guiding feature is configured to direct relative motion between the base and the bracket. The link bar and the guiding feature are also configured to transfer an external force applied to the handle, the external force being transferred to the upper and lower circuit boards via the base and the bracket.

Force saving mechanism for circuit board installation

A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

Multi-stage liquid cooling system

A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.

System and method for hybrid direct-to-chip liquid and immersion cooling

A computing system includes a chassis, a water circulation network coupled to the chassis, a power distribution network coupled to the chassis, and one or more sleds removably coupled to the chassis. The water circulation network includes a cold water distribution network and a hot water collection network. Each sled of the one or more sleds includes a corresponding cold plate. Each sled is configured to slide along the chassis in two slide directions including a slide-close direction to reach a closed position and a slide-open direction to vacate the closed position. When in the closed position, each sled is configured to (a) bridge the hot water collection network and the cold water distribution network via the corresponding cold plate and (b) couple to the power distribution network.

Modular liquid cooling for multi-node computing systems

A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

Nucleation surface treatment for thermal cooling

A liquid cooling rack assembly for a computing system includes a first cabinet rack configured to receive within a plurality of computing devices with heat-generating electronic components; and a second cabinet rack configured to receive coolant components. The second cabinet rack has a plurality of movable trays, each tray of the plurality of movable trays being movable generally horizontally and independently of other trays of the plurality of movable trays. The liquid cooling rack assembly further includes a plurality of cooling pumps. Each pump of the plurality of cooling pumps is placed on a respective one of the plurality of movable trays, and each pump is independently serviceable from other pumps of the plurality of cooling pumps based on independent movement of a respective tray.

Liquid cooling rack assembly for computing system and telecommunication system including the same

A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.

System and method for cooling electronic computing device with multiple-function pump

A partition device for improving cooling of a heat-generating electronic device includes a grid panel and an airflow deflector. The grid panel has one or more apertures and a thickness that extends from a leading surface to a trailing surface. The apertures of the grid panel extend parallel to an airflow direction of forced air flowing across the thickness of the grid panel and through the apertures. The airflow deflector is attached at least in part within one of the apertures, and the airflow deflector has an airfoil shape for reducing air resistance between the forced air and the grid panel. The airfoil shape has a leading edge that redirects initial contact with the forced air and a trailing edge that continues redirecting the forced air.

Partition device with airfoil-shaped airflow deflectors

A single-phase immersion cooling system includes an immersion cooling tank having a component area, which is separate from a main chamber and is configured to receive a heat-generating electronic device. A coolant circulates along a flow path, in a chamber path through the main chamber and a component path through the component area. A rotating propeller is mounted within the immersion cooling tank, causing a driven flow path in the component area. The driven flow path is configured to cause contact between the coolant in the driven flow path and the heat-generating electronic device when the heat-generating electronic device is received within the component area. The coolant in the driven flow path circulates at a faster speed than the coolant in the chamber path.

Force convection driven by propeller applied in single-phase immersion cooling

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Systems and methods for cooling a fluid circuit for cooling a rack of servers

A system is disclosed. The system includes a housing having a top wall, a bottom wall, and two opposing side walls extending generally between and connecting the top wall to the bottom wall. The housing further has an airflow inlet and an airflow outlet opposing the airflow inlet. The system further includes a plurality of components within the housing. The plurality of components are arranged in rows with spaces between the rows. The system further includes a board coupled to the plurality of components on a first side and coupled to the bottom wall of the housing on a second side, opposing the first side. The board includes an aperture. The board and the bottom wall of the housing define a channel. The system further includes one or more of an injection ramp, a diversion ramp, and/or an airfoil for directing airflow within the housing.

Housing with one or more airflow elements

A mounting system for an electronic device is disclosed. The mounting system includes a mounting plate; a plurality of fasteners for coupling the mounting plate with the electronic device; a single main gear mounted on the mounting plate; a plurality of secondary gears coupled, respectively, to the plurality of fasteners; and a plurality of intermediate gears mounted on the mounting plate and rotationally coupled between the single main gear and the plurality of secondary gears. Rotation of each of the plurality of secondary gears causes a fastening movement of a respective one of the plurality of fasteners. Simultaneous rotation of the plurality of intermediate gears causes the plurality of secondary gears to rotate simultaneously in response to a single rotational force being received by the main gear. The simultaneous rotation of the plurality of intermediate gears causes a simultaneous fastening movement of the plurality of secondary gears.

Mounting system for an electronic device

A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.

Fan module with handle

A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Systems and methods for vapor-compressed cooling

An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

Air duct with one or more fins

Growing community of inventors

Taoyuan, Taiwan

Chao-Jung Chen