Taiwan Semiconductor Manufacturing Comp. Ltd.

Chao-Hung Chu

Chun-Ren Cheng

Yi-Hsien Chang

Shih-Fen Huang

Yi Heng Tsai

Ching-Hui Lin

Fu-Chun Huang

Po-Chen Yeh

The present disclosure relates to an integrated chip structure. The integrated chip structure includes a dielectric stack disposed on a substrate. The integrated chip structure further includes one or more piezoelectric ultrasonic transducers (PMUTs) and one or more capacitive ultrasonic transducers (CMUTs). The one or more PMUTs include a piezoelectric stack disposed within the dielectric stack over one or more PMUT cavities. The one or more CMUTs include electrodes disposed within the dielectric stack and separated by one or more CMUT cavities. An isolation chamber is arranged within the dielectric stack laterally between the one or more PMUTs and the one or more CMUTs. The isolation chamber vertically extends past at least a part of both the one or more PMUTs and the one or more CMUTs.

Hybrid ultrasonic transducer system

Growing community of inventors

Keelung, Taiwan

Chao-Hung Chu