Industrial Technology Research Institute

Chao-Hui Lin

Kuang-Chung Tao

Chien-Kuang Lee

Chung-Chiang Ku

A transistor switch comprises a first field-effect transistor, a second field-effect transistor, a clamping circuit and a coupling circuit. The first field-effect transistor is controlled by a first voltage source to be turned on during a transmission mode. The second field-effect transistor, which is controlled by a second voltage source to be turned off during the transmission mode, has one current carrying terminal connected to the first field-effect transistor. The clamping circuit is connected between a gate of the second field-effect transistor and the second voltage source. The coupling circuit is connected between the gate and one current carrying terminal of the second field-effect transistor.

High power transistor switch with low transmission loss

An optical receiver preamplifier provides a transimpedance feedback path between the output node and the input node that comprises a feedback resister and the two diodes are coupled ('paralleled') in opposite direction. While the input current signal is too large, and the voltage reach the diode's threshold voltage. The preamplifier can provide current path passing the signal to solve the problem that charge-discharge time is not uniform and changed over duty-cycle. Further, the two diodes are coupled ('paralleled') in opposite direction make photo-diode working under the large-signal current by anode or cathode input. Thus, increase the dynamic range of the transimpedance preamplifier. Besides, the low impedance of series resistance connects with input node and feedback network. The influence of bandwidth and stability that the aforementioned two paralleled diodes resulted in diode junction capacitor will reduce due to the low impedance of series resistance. And more specifically, in high-speed application, also increase the impedance of series resistance.

High dynamic range optical receiver preamplifier

A surface mountable microwave IC package with broad bandwidth and low loss has been developed. The impedance mismatch due to the electrical discontinuity of the I/O pads and via holes in the structure is compensated. The compensation structure has two features. In one feature, ground planes are printed on both sides of a dielectric substrate to increase the distributed capacitance between the signal line and the ground, thereby obtaining a matched characteristic impedance. In the second feature, two grounding via holes are used to compensate for the mismatch of the charactersitic impedance due to the feedthrough via-slot connection of the signal line from the back-side to the front-side of the substrate.

Surface mountable microwave IC package

The present invention discloses an apparatus for testing an integrated circuit (IC) chip having a plurality of testing ports, each of the testing ports being used for connection with an testing interface assembly for further connection with external testing equipment. The apparatus includes a testing platform having a top surface, the top surface includes a chip placement means for securely placing the IC chip therein. The testing platform further includes a plurality of guiding posts extending upwardly from the top surface. The testing apparatus further includes a frame-housing which has a plurality of inter-connected walls, each of the walls further has an inner surface including an inner beam attached thereon. The inner surface and the inner beam define an elongated vertical space corresponding to each of the guiding posts of the testing platform. Each of the walls near the inner beam further includes an access means which has a plurality of openings allowing access of the testing interface assembly for connecting with the testing ports on the IC chip. Each of the guiding posts further including a locking means whereby when the frame-housing sliding along the guiding posts fitting each of the elongated vertical spaces defined by the inner wall surfaces and the inner beams thus surrounding the corresponding guiding post, the locking means further securely locks the frame-housing onto the testing platform.

Apparatus and method for testing packaged integrated circuits

This invention discloses a monolithic microwave integrated circuit (MMIC) package with filtering property. The filtering action is inherent with the structure of the package. This structure overcomes the limitation of traditional packages, which can only transmit the signal without processing the signal. A specially designed surface-mountable structure is used in the input and the output terminals. Any impedance from this special structure can be compensated by the filtering structure in each port. The filtering structure is located between the input (or the output) structure and the die cavity in each port. The package also provides ground connection to the MMIC by means of metal-filled via holes connected to the surface mounting side.

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Hsinchu, Taiwan

Chao-Hui Lin