Taiwan Semiconductor Manufacturing Comp. Ltd.

National Yang Ming Chiao Tung University

Chao-Hsin Chien

Chen-Han Chou

Chi-Wen Liu

Samuel C Pan

Cheng-Ting Chung

Yu-Che Chou

Chao-Ching Cheng

Yun-Yan Chung

Chin-Ya Yi

Che-Wei Chen

Chung-Chun Hsu

Wei-Chun Chi

Chien-Wei Tsai

Li-Cheng Teng

Wan-Hsuan Chung

An integrated circuit device includes a semiconductor substrate, a first gate structure, a channel layer, source and drain features, a second gate structure, a first contact, and a second contact. The first gate structure is over the semiconductor substrate. The first gate structure includes a gate dielectric layer and a first gate electrode. The channel layer is over and surrounded by the first gate structure. The source and drain features are respectively on opposite first and second sides of the channel layer. The second gate structure is over the channel layer. The second gate structure includes a programming gate dielectric layer having a data storage layer and a second gate electrode over the programming gate dielectric layer. The first gate contact is on the first gate electrode. The second gate contact is on the second gate electrode.

Method for fabricating integrated circuit device with two gate structures

Structures and methods of forming self-aligned unsymmetric gate (SAUG) FinFET are provided. The SAUG FinFET structure has two different gate structures on opposite sides of each fin: a programming gate structure and a switching gate structure. The SAUG FinFET may be used as non-volatile memory (NVM) storage element that may be electrically programmed by trapping charges in the charge trapping dielectric (e.g., SiN) with appropriate bias on the control gate of the programming gate structure. The stored data may be sensed by sensing the channel current through the SAUG FinFET in response to a bias on the switching gate of the switching gate structure.

Self-aligned unsymmetrical gate (SAUG) FinFET and methods of forming the same

In an embodiment, a method includes forming a first gate electrode over a substrate. The method also includes forming a first gate dielectric layer over the first gate electrode. The method also includes depositing a semiconductor layer over the first gate dielectric layer. The method also includes forming source/drain regions over the first gate dielectric layer and the semiconductor layer, the source/drain regions overlapping ends of the semiconductor layer. The method also includes forming a second gate dielectric layer over the semiconductor layer and the source/drain regions. The method also includes and forming a second gate electrode over the second gate dielectric layer.

Semiconductor device and method

A method of manufacturing a semiconductor device includes forming a first metal layer on a semiconductor substrate and forming a second metal layer on the first metal layer. The second metal layer is formed of a different metal than the first metal layer. Microwave radiation is applied to the semiconductor substrate, first metal layer, and second metal layer to form an alloy including components of the first metal layer, second metal layer, and the semiconductor substrate.

Method of manufacturing a semiconductor device including a ternary alloy layer formed by a microwafe anneal process

A semiconductor device including a Fin FET device includes a fin structure extending in a first direction and protruding from a substrate layer. The fin structure includes a bulk stressor layer formed on the substrate layer and a channel layer disposed over the bulk stressor layer. An oxide layer is formed on the substrate layer extending away from the channel layer. A source-drain (SD) stressor structure is disposed on sidewalls of the channel layer over the oxide layer. A gate stack including a gate electrode layer and a gate dielectric layer covers a portion of the channel layer and extends in a second direction perpendicular to the first direction.

Semiconductor device including a fin structure

A semiconductor device including at least one fin disposed on a surface of a semiconductor substrate is provided. The fin includes a main portion extending along a first direction, and at least one secondary portion extending outward from the main portion along a second direction not collinear with the first direction.

FinFET semiconductor device having fins with stronger structural strength

Semiconductor device and manufacturing method thereof

A semiconductor device and methods of formation are provided. The semiconductor device includes a first metal alloy over a first active region of a fin and a second metal alloy over a second active region of the fin. A conductive layer is over a channel region of the fin. A semiconductive layer is over the conductive layer. The conductive layer over the channel region suppresses current leakage and the semiconductive layer over the conductive layer reduces electro flux from a source to a drain, as compared to a channel region that does not have such a conductive layer or a semiconductive layer over a conductive layer. The semiconductor device having the first metal alloy as at least one of the source or drain requires a lower activation temperature than a semiconductor device that does not have a metal alloy as a source or a drain.

Semiconductor device with metal alloy over fin, conductive layer over channel region of fin, and semiconductive layer over conductive layer and formation thereof

Semiconductor devices and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a semiconductor device may include: patterning a substrate to have a first region and a second region extending from the first region of the substrate; depositing an isolation layer over a surface of the first region of the substrate; and epitaxially forming source/drain regions over the isolation layer and adjacent to sidewalls of the second region of the substrate.

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Hsinchu, Taiwan

Chao-Hsin Chien