Foxconn Technology Co., Ltd.

Chao-Hao Wang

Hsien-Sheng Pei

Chang-Shen Chang

Juei-Khai Liu

An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.

Heat pipe with composite wick structure

A heat pipe includes an elongated casing (), a wick (), at least one artery mesh (), and working medium filling in the casing. The casing has an evaporating section () and a condensing section (). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion () and a small portion () with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.

A heat spreader includes a bottom wall () and a cover () hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space () therebetween for receiving a working fluid therein. A wick structure () is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

Heat spreader with vapor chamber defined therein

An LED lamp cooling apparatus () includes a substrate (), a plurality of LEDs () electrically connected with the substrate, a heat sink () for dissipation of heat generated by the LEDs and a pulsating heat pipe () thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions () and a plurality of heat radiating portions (), and contains a working fluid () therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

LED lamp cooling apparatus with pulsating heat pipe

A light-emitting diode (LED) assembly includes a circuit board (), at least one LED () being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus () being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole () corresponding to a position of the at least one LED. Thermal interface material () is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.

Growing community of inventors

Taipei Hsien, Taiwan

Chao-Hao Wang