Htc Corporation

Chao-Feng Wan

Cheng-Han Chung

Chun-Sheng Chao

Ming-Jer Yang

A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.

Manufacturing method of casing of electronic device

A casing of an electronic device including a casing body and a sensing assembly is provided. The casing body includes a button portion. The sensing assembly includes a first conductive line and two first contacts. The first conductive line is disposed on an inner surface of the casing body, and the first conductive line forms a strain sensing pattern on the button portion. The first contacts are disposed on the inner surface of the casing body, and connected to two ends of the first conductive line, respectively. The strain sensing pattern is adapted to result a resistance variation accompanied with a deformation of the button portion when the button portion is deformed, so as to generate an electrical signal.

Electronic device and casing thereof

A main computer for vehicle includes a central processing unit and a programmable logic device. The central processing unit is configured for controlling operations of the main computer. The programmable logic device is coupled to the central processing unit and includes a built-in power state machine for managing power statuses of the main computer. The power state machine includes a turn-off status, an operating status, and a predetermined status located between the turn-off status and the operating status.

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Taoyuan County, Taiwan

Chao-Feng Wan