Mpi Corporation

Chao-Ching Huang

Wei-Cheng Ku

Chih-Hao Ho

Wen-Chi Chen

Chiu-Chu Chang

A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Probe card having configurable structure for exchanging or swapping electronic components for impedance matching

A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided.

Combined probe head for a vertical probe card and method for assembling and aligning the combined probe head thereof

A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore

Growing community of inventors

Hsinchu Hsiang, Taiwan

Chao-Ching Huang