Au Optronics Corporation

Auo Corporation

Chao-Chien Chiu

Shih-Hua Lu

Ruei-Pei Chen

Shang-Wei Hsieh

Po-Chao Chang

Ming-Hsien Lee

Wei-Ming Huang

Chia-Tien Peng

Jia-Hong Ye

Wu-Hsiung Lin

Ssu-Hui Lu

Yan-Liang Chen

Shuo-Hong Wang

Ching-Shun Lin

Xiang-Rui Chang

Kuo-Yu Huang

Yang-En Wu

Ken-Yu Liu

Yu-Han Huang

Hsun-Chen Chu

Cheng-Chieh Lee

Shih-Hsing Hung

A photosensitive device includes a first photosensitive unit, a first collimator layer, a first lens, and a first dummy lens. The first photosensitive unit includes a first photosensitive component and a first control circuit. The first control circuit is electrically connected to the first photosensitive component. The first collimator layer is located above the first photosensitive component and has a first pinhole and a first dummy pinhole. The first lens is located above the first collimator layer and overlapping with the first photosensitive component and the first pinhole in a first direction. The first dummy lens is located above the first collimator layer and overlapping with the first dummy pinhole in the first direction.

Photosensitive device with collimator layer and lens array

A capacitive fingerprint sensor is provided. The capacitive fingerprint sensor includes a plurality of capacitive sensing pixels. Each of the capacitive sensing pixels includes a sensing node, a first transistor, a sensing capacitor and a second transistor. The first transistor has a first terminal receiving a first system voltage, a control terminal receiving a reset control signal, and a second terminal coupled to the sensing node. The sensing capacitor is coupled between the sensing node and a sensing control signal. The second transistor has a first terminal receiving a second system voltage, a control terminal receiving a sensing voltage of the sensing node, and a second terminal providing a sensing output signal.

Capacitive fingerprint sensor

A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.

Sensing device

An optical sensing device includes a substrate, sensing elements, a planarization layer, and a light-shielding layer. The sensing elements are located on the substrate. Each sensing element includes a first net-shaped electrode, a second net-shaped electrode, and a sensing layer. The first net-shaped electrode is located between the sensing layer and the substrate. The sensing layer is located between the first net-shaped electrode and the second net-shaped electrode. The planarization layer is located on the sensing elements and the substrate and has via holes. The light-shielding layer is located on the planarization layer and includes net-shaped light-shielding patterns. The net-shaped light-shielding patterns are overlapped with the second net-shaped electrodes of the sensing elements, respectively, and the net-shaped light-shielding patterns are electrically connected to the second net-shaped electrodes of the sensing elements via the via holes, respectively.

Optical sensing device

An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

Optical sensing device and electronic apparatus having the same

A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

Fingerprint sensing module

A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.

Fingerprint sensing device

An optical sensing device includes a substrate, a sensing element layer, a first planarization layer, and a second planarization layer. The sensing element layer is located on the substrate and includes a plurality of sensing elements. The first planarization layer is located on the sensing element layer and has a first slit. The second planarization layer is located on the first planarization layer and has a second slit. An orthogonal projection of the first slit extending in a direction and located on the substrate is not overlapped with an orthogonal projection of the second slit extending in the same direction and located on the substrate, and the orthogonal projection of the second slit on the substrate has a curved pattern.

A biological feature identification device includes a display device and a sensing device. The display device includes multiple pixels arranged along a first direction. The pixels each has a sub-pixel having a display element and a switch element. The sensing device includes multiple sensing units arranged along a second direction. The sensing units each has a sensing element. When the spatial frequency relation is |4*(RE/100)&#x2212;(1/SU)|&#x3e;A, the first and second directions are the same, and the biological feature identification device satisfy the criteria: A&#x3c;|4*(RE/100)&#x2212;(1/SU)|&#x3c;B. When the spatial frequency relation is |4*(RE/100)&#x2212;(1/SU)|&#x2264;A, the first and second directions form an angle, and the biological feature identification device satisfy the criteria: A&#x3c;|4*(RE/100)&#x2212;{1/[SU*Cos(&#x3b1;)]}|&#x3c;C. RE is the resolution of the display device, SU is the sensing unit size, &#x3b1; is the angle, 0&#xb0;&#x3c;&#x3b1;&#x3c;90&#xb0;, B and C&#x3e;A, and A is not equal to zero.

Biological feature identification device and manufacturing method of the same

A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=(x/2&#xd7;tan &#x3b8;), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and &#x3b8; is an FWHM light receiving angle of each of the micro lenses.

Fingerprint recognition device

A real/fake fingerprint recognition device includes a light source, a detector, and a processor. The light source is configured to provide a first color light and a second color light to a fingerprint. The detector is configured to receive a first reflect light corresponding to the first color light, and receive a second reflect light corresponding to the second color light. The processor is configured to establish a first image and a second image according to the first reflect light and the second reflect light respectively, and determine whether the fingerprint is a real fingerprint according to the first image and the second image.

Real/fake fingerprint recognition device, method, and non-transitory computer readable storage medium

A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.

A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.

Photosensitive element having substantially flat interface between electrode and photosensitive layer and manufacturing method thereof

A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

Photosensor

A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.

Growing community of inventors

Hsinchu, Taiwan

Chao-Chien Chiu