Stmicroelectronics S.r.l.

Stmicroelectronics (malta) Ltd

Chantal Combi

Lorenzo Baldo

Benedetto Vigna

Mario Francesco Cortese

Federico Giovanni Ziglioli

Caterina Riva

Mark Anthony Azzopardi

Edward Myers

Flavio Francesco Villa

Ernesto Lasalandra

Dino Faralli

Manuela Magugliani

Gabriele Barlocchi

Mark Andrew Shaw

Pietro Corona

Simone Sassolini

Marco Del Sarto

Giuseppe Visalli

Marta Mottura

Anna Angela Pomarico

Simona Petroni

Andrea Rusconi Clerici Beltrami

Matteo Fiorito

Angela Pomarico

A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.

Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Packaged sensor structure having sensor opening and package opening aligned with sensor element

Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.

Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type

Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passing opening of the substrate and the further opening of the second surface.

Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates

In a data-input device an actuator element that can be manually actuated, and a sensor mechanically coupled to the actuator element. The sensor is formed in a body of semiconductor material housing a first sensitive element, which detects the actuation of the actuator element and generates electrical control signals. The first sensitive element is a microelectromechanical pressure sensor, formed by: a cavity made within the body; a diaphragm made in a surface portion of the body and suspended above the cavity; and piezoresistive transducer elements integrated in peripheral surface portions of the diaphragm in order to detect its deformations upon actuation of the actuator element.

Analog data-input device provided with a pressure sensor of a microelectromechanical type

In an input device, a control element is operated by a user; a pressure sensor is mechanically coupled to the control element and is provided with a monolithic body of semiconductor material housing a first sensitive element, which detects an actuation of the control element; a supporting element is connected to the pressure sensor; and connection elements electrically connect the monolithic body to the supporting element without interposition of a package. In particular, the monolithic body has electrical-contact areas carried by one main surface thereof, and the printed circuit board has conductive regions carried by a main face thereof; the connection elements are conductive bumps and electrically connect the electrical-contact areas to the conductive regions.

Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device

A process for manufacturing an integrated membrane made of semiconductor material includes the step of forming, in a monolithic body of semiconductor material having a front face, a buried cavity, extending at a distance from the front face and delimiting with the front face a surface region of the monolithic body, the surface region forming a membrane that is suspended above the buried cavity. The process further envisages the step of forming an insulation structure in a surface portion of the monolithic body to electrically insulate the membrane from the monolithic body; and the further and distinct step of setting the insulation structure at a distance from the membrane so that it will be positioned outside the membrane at a non-zero distance of separation.

Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate

A micro-electro-mechanical variable capacitor has a first and a second electrode, and a dielectric region arranged on the first electrode. An intermediate electrode is arranged on the dielectric region. The first electrode is fixed and anchored to a substrate, and the second electrode includes a membrane movable with respect to the first electrode according to an external actuation, in particular an electrostatic force due to an actuation voltage applied between an actuation electrode and the first electrode. The second electrode is suspended over the intermediate electrode in a first operating condition, and contacts the intermediate electrode in a second operating condition; in particular, in the second operating condition, a short-circuit is established between the second electrode and the intermediate electrode.

Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness

Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.

Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device

A surface acoustic wave pressure sensor includes: a substrate and at least one flexible membrane, suspended over a cavity defined in the thickness of the substrate, the membrane being elastically deformable by a pressure applied by a fluid and being defined between a first surface facing the cavity and a second opposite surface; a SAW device comprising a layer of piezoelectric material arranged on the second surface of the membrane, the SAW device further comprising at least one SAW electro-acoustic transducer formed on one free surface of the piezoelectric layer. The piezoelectric layer is formed by deposition of piezoelectric material on the membrane and the substrate is integrated in a chip of semiconductor material, the membrane being a layer of the chip suspended over the cavity.

Surface acoustic wave pressure sensor

A manufacturing process of a semiconductor piezoresistive accelerometer includes the steps of: providing a wafer of semiconductor material; providing a membrane in the wafer over a cavity; rigidly coupling an inertial mass to the membrane; and providing, in the wafer, piezoresistive transduction elements, that are sensitive to strains of the membrane and generate corresponding electrical signals. The step of coupling is carried out by forming the inertial mass on top of a surface of the membrane opposite to the cavity. The accelerometer is advantageously used in a device for monitoring the pressure of a tire of a vehicle.

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Oggiono, Italy

Chantal Combi